IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-124-14-071003

510-93-124-14-071003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,921 -

RFQ

510-93-124-14-071003

データシート

Bulk 510 Active PGA 124 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-364-17-091147

546-87-364-17-091147

CONN SOCKET PGA 364POS GOLD

Preci-Dip
3,927 -

RFQ

546-87-364-17-091147

データシート

Bulk 546 Active PGA 364 (17 x 17) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-93-125-13-041001

510-93-125-13-041001

SOCKET SOLDERTAIL 125-PGA

Mill-Max Manufacturing Corp.
3,873 -

RFQ

Bulk 510 Active PGA 125 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-125-14-071001

510-93-125-14-071001

SOCKET SOLDERTAIL 125-PGA

Mill-Max Manufacturing Corp.
3,583 -

RFQ

Bulk 510 Active PGA 125 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-125-13-041002

510-93-125-13-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,295 -

RFQ

510-93-125-13-041002

データシート

Bulk 510 Active PGA 125 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-125-13-041003

510-93-125-13-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,729 -

RFQ

510-93-125-13-041003

データシート

Bulk 510 Active PGA 125 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-125-14-071002

510-93-125-14-071002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,760 -

RFQ

510-93-125-14-071002

データシート

Bulk 510 Active PGA 125 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-125-14-071003

510-93-125-14-071003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,610 -

RFQ

510-93-125-14-071003

データシート

Bulk 510 Active PGA 125 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-365-14-000147

546-87-365-14-000147

CONN SOCKET PGA 365POS GOLD

Preci-Dip
3,771 -

RFQ

546-87-365-14-000147

データシート

Bulk 546 Active PGA 365 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-365-17-091147

546-87-365-17-091147

CONN SOCKET PGA 365POS GOLD

Preci-Dip
2,027 -

RFQ

546-87-365-17-091147

データシート

Bulk 546 Active PGA 365 (17 x 17) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-43-668-61-105000

117-43-668-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,823 -

RFQ

Tube * Active - - - - - - - - - - - - - -
550-80-296-19-131135

550-80-296-19-131135

PGA SOLDER TAIL

Preci-Dip
2,031 -

RFQ

550-80-296-19-131135

データシート

Bulk 550 Active PGA 296 (19 x 19) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-279-19-081117

514-83-279-19-081117

CONN SOCKET PGA 279POS GOLD

Preci-Dip
3,689 -

RFQ

514-83-279-19-081117

データシート

Bulk 514 Active PGA 279 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
40-0511-11

40-0511-11

CONN SOCKET SIP 40POS GOLD

Aries Electronics
2,350 -

RFQ

40-0511-11

データシート

Bulk 511 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
514-83-272M20-001148

514-83-272M20-001148

CONN SOCKET BGA 272POS GOLD

Preci-Dip
2,684 -

RFQ

514-83-272M20-001148

データシート

Bulk 514 Active BGA 272 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-255M16-001101

558-10-255M16-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
2,371 -

RFQ

558-10-255M16-001101

データシート

Bulk 558 Active PGA 255 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
120-PGM13015-11

120-PGM13015-11

CONN SOCKET PGA GOLD

Aries Electronics
3,803 -

RFQ

120-PGM13015-11

データシート

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
44-3551-11

44-3551-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics
3,903 -

RFQ

44-3551-11

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3552-11

44-3552-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics
2,105 -

RFQ

44-3552-11

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3553-11

44-3553-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics
2,814 -

RFQ

44-3553-11

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Record«Prev1... 657658659660661662663664...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
日文版

ホーム

日文版

製品

日文版

電話

日文版

ユーザー