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IC、トランジスタ用ソケット

メーカー部品番号	在庫状況	価格	数量	データシート	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
510-83-040-11-061101 CONN SOCKET PGA 40POS GOLD Preci-Dip	2,596	-	RFQ	データシート	Bulk	510	Active	PGA	40 (11 x 11)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-008101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	2,463	-	RFQ	データシート	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
04-3513-11 CONN IC DIP SOCKET 4POS GOLD Aries Electronics	2,525	-	RFQ	データシート	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
06-0513-11H CONN SOCKET SIP 6POS GOLD Aries Electronics	3,238	-	RFQ	データシート	Bulk	0513	Active	SIP	6 (1 x 6)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
07-0513-11 CONN SOCKET SIP 7POS GOLD Aries Electronics	2,614	-	RFQ	データシート	Bulk	0513	Active	SIP	7 (1 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-11 CONN SOCKET SIP 11POS GOLD Aries Electronics	3,355	-	RFQ	データシート	Bulk	518	Active	SIP	11 (1 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
02-0508-21 CONN SOCKET SIP 2POS GOLD Aries Electronics	2,936	-	RFQ	データシート	Bulk	508	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
02-0508-31 CONN SOCKET SIP 2POS GOLD Aries Electronics	2,612	-	RFQ	データシート	Bulk	508	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
02-1508-21 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	2,255	-	RFQ	データシート	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
02-1508-31 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	3,438	-	RFQ	データシート	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	2 (1 x 2)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6
06-3513-11 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	2,424	-	RFQ	データシート	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-10T CONN IC DIP SOCKET 24POS GOLD Aries Electronics	3,807	-	RFQ	データシート	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-322-41-009101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	3,761	-	RFQ	データシート	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-009101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	3,385	-	RFQ	データシート	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-011101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	3,643	-	RFQ	データシート	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-11-001101 CONN SOCKET PGA 68POS GOLD Preci-Dip	2,058	-	RFQ	データシート	Bulk	510	Active	PGA	68 (11 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-11-061101 CONN SOCKET PGA 68POS GOLD Preci-Dip	3,361	-	RFQ	データシート	Bulk	510	Active	PGA	68 (11 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-11-062101 CONN SOCKET PGA 68POS GOLD Preci-Dip	2,632	-	RFQ	データシート	Bulk	510	Active	PGA	68 (11 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-10-001101 CONN SOCKET PGA 68POS GOLD Preci-Dip	3,076	-	RFQ	データシート	Bulk	510	Active	PGA	68 (10 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-10-061101 CONN SOCKET PGA 68POS GOLD Preci-Dip	3,484	-	RFQ	データシート	Bulk	510	Active	PGA	68 (10 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled