IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
550-10-500M30-001166

550-10-500M30-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,945 -

RFQ

550-10-500M30-001166

データシート

Bulk 550 Active BGA 500 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-83-352M26-001148

514-83-352M26-001148

CONN SOCKET BGA 352POS GOLD

Preci-Dip
2,656 -

RFQ

514-83-352M26-001148

データシート

Bulk 514 Active BGA 352 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-685-19-000111

517-83-685-19-000111

CONN SOCKET PGA 685POS GOLD

Preci-Dip
2,445 -

RFQ

517-83-685-19-000111

データシート

Bulk 517 Active PGA 685 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-325-18-111144

614-87-325-18-111144

CONN SOCKET PGA 325POS GOLD

Preci-Dip
2,257 -

RFQ

614-87-325-18-111144

データシート

Bulk 614 Active PGA 325 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-504M29-001166

550-10-504M29-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,983 -

RFQ

550-10-504M29-001166

データシート

Bulk 550 Active BGA 504 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-352M26-001152

550-10-352M26-001152

BGA SOLDER TAIL

Preci-Dip
3,710 -

RFQ

550-10-352M26-001152

データシート

Bulk 550 Active BGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-391-18-101147

546-83-391-18-101147

CONN SOCKET PGA 391POS GOLD

Preci-Dip
3,084 -

RFQ

546-83-391-18-101147

データシート

Bulk 546 Active PGA 391 (18 x 18) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-356M26-001148

514-83-356M26-001148

CONN SOCKET BGA 356POS GOLD

Preci-Dip
2,200 -

RFQ

514-83-356M26-001148

データシート

Bulk 514 Active BGA 356 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-296-19-131135

550-10-296-19-131135

PGA SOLDER TAIL

Preci-Dip
2,128 -

RFQ

550-10-296-19-131135

データシート

Bulk 550 Active PGA 296 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-360M19-001148

514-83-360M19-001148

CONN SOCKET BGA 360POS GOLD

Preci-Dip
3,393 -

RFQ

514-83-360M19-001148

データシート

Bulk 514 Active BGA 360 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-357M19-001152

550-10-357M19-001152

BGA SOLDER TAIL

Preci-Dip
2,056 -

RFQ

550-10-357M19-001152

データシート

Bulk 550 Active BGA 357 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-360M19-001152

550-10-360M19-001152

BGA SOLDER TAIL

Preci-Dip
2,211 -

RFQ

550-10-360M19-001152

データシート

Bulk 550 Active BGA 360 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-87-456M26-001148

514-87-456M26-001148

CONN SOCKET BGA 456POS GOLD

Preci-Dip
3,995 -

RFQ

514-87-456M26-001148

データシート

Bulk 514 Active BGA 456 (26 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-520M31-001166

550-10-520M31-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,125 -

RFQ

550-10-520M31-001166

データシート

Bulk 550 Active BGA 520 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-87-503-22-131147

546-87-503-22-131147

CONN SOCKET PGA 503POS GOLD

Preci-Dip
3,825 -

RFQ

546-87-503-22-131147

データシート

Bulk 546 Active PGA 503 (22 x 22) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-296-19-131147

546-87-296-19-131147

CONN SOCKET PGA 296POS GOLD

Preci-Dip
3,290 -

RFQ

546-87-296-19-131147

データシート

Bulk 546 Active PGA 296 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-352M26-001101

558-10-352M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
2,268 -

RFQ

558-10-352M26-001101

データシート

Bulk 558 Active PGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-403-19-111147

546-83-403-19-111147

CONN SOCKET PGA 403POS GOLD

Preci-Dip
2,848 -

RFQ

546-83-403-19-111147

データシート

Bulk 546 Active PGA 403 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-356M26-001101

558-10-356M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
3,765 -

RFQ

558-10-356M26-001101

データシート

Bulk 558 Active PGA 356 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-357M19-001101

558-10-357M19-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
2,044 -

RFQ

558-10-357M19-001101

データシート

Bulk 558 Active PGA 357 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
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1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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