IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-83-428-41-035101

146-83-428-41-035101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,226 -

RFQ

146-83-428-41-035101

データシート

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-428-41-036101

146-83-428-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,469 -

RFQ

146-83-428-41-036101

データシート

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-628-41-035101

146-83-628-41-035101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,666 -

RFQ

146-83-628-41-035101

データシート

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-628-41-036101

146-83-628-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,925 -

RFQ

146-83-628-41-036101

データシート

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-013101

116-87-314-41-013101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,355 -

RFQ

116-87-314-41-013101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-648-41-005101

117-83-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,898 -

RFQ

117-83-648-41-005101

データシート

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-008101

116-83-424-41-008101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,423 -

RFQ

116-83-424-41-008101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-008101

116-83-624-41-008101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,422 -

RFQ

116-83-624-41-008101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-318-10-001101

299-87-318-10-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,840 -

RFQ

299-87-318-10-001101

データシート

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-012101

116-87-636-41-012101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,936 -

RFQ

116-87-636-41-012101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-011101

116-87-324-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,987 -

RFQ

116-87-324-41-011101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-011101

116-87-424-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,457 -

RFQ

116-87-424-41-011101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-011101

116-87-624-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,325 -

RFQ

116-87-624-41-011101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-650-41-001101

110-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,731 -

RFQ

110-83-650-41-001101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-950-41-001101

110-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,758 -

RFQ

110-83-950-41-001101

データシート

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-002101

116-87-432-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,598 -

RFQ

116-87-432-41-002101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-648-41-001101

612-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,714 -

RFQ

612-87-648-41-001101

データシート

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-642-31-012101

614-87-642-31-012101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,776 -

RFQ

614-87-642-31-012101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-018101

116-83-432-41-018101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,740 -

RFQ

116-83-432-41-018101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-650-41-001101

614-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,371 -

RFQ

614-87-650-41-001101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 6768697071727374...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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