IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-650-41-005101

110-83-650-41-005101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,613 -

RFQ

110-83-650-41-005101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-422-41-002101

124-83-422-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,300 -

RFQ

Bulk 124 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-108-12-051101

510-87-108-12-051101

CONN SOCKET PGA 108POS GOLD

Preci-Dip
3,615 -

RFQ

510-87-108-12-051101

データシート

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-320-11-001101

299-87-320-11-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,100 -

RFQ

299-87-320-11-001101

データシート

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-614-10-002101

299-87-614-10-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,596 -

RFQ

299-87-614-10-002101

データシート

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-006101

116-87-652-41-006101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,241 -

RFQ

116-87-652-41-006101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-109-12-051101

510-87-109-12-051101

CONN SOCKET PGA 109POS GOLD

Preci-Dip
3,367 -

RFQ

510-87-109-12-051101

データシート

Bulk 510 Active PGA 109 (12 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-648-41-117101

114-83-648-41-117101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,579 -

RFQ

114-83-648-41-117101

データシート

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-018101

116-83-636-41-018101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,797 -

RFQ

116-83-636-41-018101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-011101

116-83-324-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,249 -

RFQ

116-83-324-41-011101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-432-41-035101

146-83-432-41-035101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,853 -

RFQ

146-83-432-41-035101

データシート

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-432-41-036101

146-83-432-41-036101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,517 -

RFQ

146-83-432-41-036101

データシート

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-650-41-001101

115-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,025 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-950-41-001101

115-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,576 -

RFQ

Bulk 115 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-013101

116-87-316-41-013101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,806 -

RFQ

116-87-316-41-013101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-011101

116-83-422-41-011101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,302 -

RFQ

116-83-422-41-011101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-950-41-005101

110-83-950-41-005101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,092 -

RFQ

110-83-950-41-005101

データシート

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-004101

116-87-324-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,553 -

RFQ

116-87-324-41-004101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-004101

116-87-424-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,488 -

RFQ

116-87-424-41-004101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-640-41-105101

110-83-640-41-105101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,780 -

RFQ

110-83-640-41-105101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 7273747576777879...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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