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| 写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-83-624-41-002101CONN IC DIP SOCKET 24POS GOLD Preci-Dip |
2,189 | - |
RFQ |
データシート |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-640-41-003101CONN IC DIP SOCKET 40POS GOLD Preci-Dip |
3,756 | - |
RFQ |
データシート |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
299-87-318-11-001101CONN IC DIP SOCKET 18POS GOLD Preci-Dip |
2,211 | - |
RFQ |
データシート |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-964-41-001101CONN IC DIP SOCKET 64POS GOLD Preci-Dip |
3,786 | - |
RFQ |
データシート |
Bulk | 110 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
4734COVER PWR TRANS .210ID TO-3 Keystone Electronics |
2,297 | - |
RFQ |
データシート |
Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APA-308-G-JADAPTER PLUG Samtec Inc. |
2,129 | - |
RFQ |
Tube | APA | Active | - | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
13-0513-10HCONN SOCKET SIP 13POS GOLD Aries Electronics |
3,753 | - |
RFQ |
データシート |
Bulk | 0513 | Active | SIP | 13 (1 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-0513-10CONN SOCKET SIP 18POS GOLD Aries Electronics |
2,380 | - |
RFQ |
データシート |
Bulk | 0513 | Active | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
ICO-308-LGTCONN IC DIP SOCKET 8POS GOLD Samtec Inc. |
2,639 | - |
RFQ |
データシート |
Tube | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
|
14-0518-00CONN SOCKET SIP 14POS GOLD Aries Electronics |
2,054 | - |
RFQ |
データシート |
Bulk | 518 | Active | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-1518-00CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
2,354 | - |
RFQ |
データシート |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
19-0518-11CONN SOCKET SIP 19POS GOLD Aries Electronics |
3,606 | - |
RFQ |
データシート |
Bulk | 518 | Active | SIP | 19 (1 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-0518-10CONN SOCKET SIP 28POS GOLD Aries Electronics |
2,971 | - |
RFQ |
データシート |
Bulk | 518 | Active | SIP | 28 (1 x 28) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
XR2A-1625CONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div |
2,034 | - |
RFQ |
データシート |
Bulk,Box | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
24-0518-10HCONN SOCKET SIP 24POS GOLD Aries Electronics |
3,259 | - |
RFQ |
データシート |
Bulk | 518 | Active | SIP | 24 (1 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-1518-10HCONN IC DIP SOCKET 24POS GOLD Aries Electronics |
2,191 | - |
RFQ |
データシート |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
117-83-652-41-005101CONN IC DIP SOCKET 52POS GOLD Preci-Dip |
3,180 | - |
RFQ |
データシート |
Bulk | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.070 (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-650-41-006101CONN IC DIP SOCKET 50POS GOLD Preci-Dip |
3,327 | - |
RFQ |
データシート |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-068-10-001101CONN SOCKET PGA 68POS GOLD Preci-Dip |
3,096 | - |
RFQ |
データシート |
Bulk | 510 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
18-3511-10CONN IC DIP SOCKET 18POS TIN Aries Electronics |
3,498 | - |
RFQ |
データシート |
Bulk | 511 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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