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| 写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
224-5248-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD 3M |
3,450 | - |
RFQ |
データシート |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
110-87-640-41-001151CONN IC DIP SOCKET 40POS GOLD Preci-Dip |
141 | - |
RFQ |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, No Center Bar | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
A-CCS 052-G-TCONN SOCKET PLCC 52POS GOLD Assmann WSW Components |
1,099 | - |
RFQ |
データシート |
Tube | - | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
28-6518-10CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
919 | - |
RFQ |
データシート |
Tube | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
228-1371-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD 3M |
2,473 | - |
RFQ |
データシート |
Tray | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
240-3639-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD 3M |
3,997 | - |
RFQ |
データシート |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 1.0 (25.40mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
220-7201-55-1902CONN SOCKET SOIC 20POS GOLD 3M |
2,373 | - |
RFQ |
データシート |
Bulk | Textool™ | Active | SOIC | 20 (2 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
264-4493-00-0602JCONN IC DIP SOCKET ZIF 64POS GLD 3M |
3,098 | - |
RFQ |
データシート |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
248-5205-00CONN SOCKET QFN 48POS GOLD 3M |
3,343 | - |
RFQ |
データシート |
Bulk | Textool™ | Active | QFN | 48 (4 x 12) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
224-5205-01CONN SOCKET QFN 24POS GOLD 3M |
3,435 | - |
RFQ |
データシート |
Bulk | Textool™ | Active | QFN | 24 (4x4) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
228-5204-01CONN SOCKET QFN 28POS GOLD 3M |
2,190 | - |
RFQ |
データシート |
Bulk | Textool™ | Active | QFN | 28 (4 x 7) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
248-5205-01CONN SOCKET QFN 48POS GOLD 3M |
2,558 | - |
RFQ |
データシート |
Bulk | Textool™ | Active | QFN | 48 (4 x 12) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
264-5205-01CONN SOCKET QFN 64POS GOLD 3M |
2,095 | - |
RFQ |
データシート |
Bulk | Textool™ | Active | QFN | 64 (4 x 16) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
84-537-21CONN SOCKET PLCC ZIF 84POS GOLD Aries Electronics |
3,485 | - |
RFQ |
データシート |
- | 537 | Active | PLCC, ZIF (ZIP) | 84 (4 x 21) | 0.100 (2.54mm) | Gold | 12.0µin (0.30µm) | - | Surface Mount | Closed Frame | - | - | - | - | - | - |
|
224-5809-00-0602CONN SOCKET SIP ZIF 24POS GOLD 3M |
3,527 | - |
RFQ |
データシート |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 24 (1 x 24) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
A 32-LC-TRCONN IC DIP SOCKET 32POS TIN Assmann WSW Components |
551 | - |
RFQ |
データシート |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
EDO-32PLCZSMCONN SOCKET PLCC 32POS On Shore Technology Inc. |
518 | - |
RFQ |
データシート |
Tube | ED | Active | PLCC | 32 (2 x 16) | 0.050 (1.27mm) | - | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | - | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
111-47-306-41-001000CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp. |
126 | - |
RFQ |
データシート |
Tube | 111 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
111-47-308-41-001000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
896 | - |
RFQ |
データシート |
Tube | 111 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
214-99-308-01-670800CONN IC DIP SOCKET 8POS TIN-LEAD Mill-Max Manufacturing Corp. |
493 | - |
RFQ |
データシート |
Tube | 214 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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- 1800+ 世界中のメーカー
- 15,000+ 在庫倉庫
