IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
34-7650-10

34-7650-10

CONN SOCKET SIP 34POS TIN

Aries Electronics
2,030 -

RFQ

34-7650-10

データシート

Bulk 700 Elevator Strip-Line™ Active SIP 34 (1 x 34) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-7725-10

34-7725-10

CONN SOCKET SIP 34POS TIN

Aries Electronics
2,118 -

RFQ

34-7725-10

データシート

Bulk 700 Elevator Strip-Line™ Active SIP 34 (1 x 34) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-7750-10

34-7750-10

CONN SOCKET SIP 34POS TIN

Aries Electronics
2,502 -

RFQ

34-7750-10

データシート

Bulk 700 Elevator Strip-Line™ Active SIP 34 (1 x 34) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
35-7435-10

35-7435-10

CONN SOCKET SIP 35POS TIN

Aries Electronics
2,154 -

RFQ

35-7435-10

データシート

Bulk 700 Elevator Strip-Line™ Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-0508-20

40-0508-20

CONN SOCKET SIP 40POS GOLD

Aries Electronics
2,782 -

RFQ

40-0508-20

データシート

Bulk 508 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
40-0508-30

40-0508-30

CONN SOCKET SIP 40POS GOLD

Aries Electronics
2,970 -

RFQ

40-0508-30

データシート

Bulk 508 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
52-9513-11H

52-9513-11H

CONN IC DIP SOCKET 52POS GOLD

Aries Electronics
2,683 -

RFQ

52-9513-11H

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6820-90C

32-6820-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
3,807 -

RFQ

32-6820-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6822-90C

32-6822-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,508 -

RFQ

32-6822-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6823-90C

32-6823-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,514 -

RFQ

32-6823-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-9503-20

30-9503-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
2,881 -

RFQ

30-9503-20

データシート

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-9503-30

30-9503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,411 -

RFQ

30-9503-30

データシート

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-822-90C

32-822-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,413 -

RFQ

32-822-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-823-90C

32-823-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
3,832 -

RFQ

32-823-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-822-90EWR

18-822-90EWR

CONN IC DIP SOCKET 18POS TIN

Aries Electronics
3,606 -

RFQ

18-822-90EWR

データシート

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-6556-11

28-6556-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,605 -

RFQ

28-6556-11

データシート

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
36-3503-20

36-3503-20

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics
3,233 -

RFQ

36-3503-20

データシート

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-3503-30

36-3503-30

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics
3,348 -

RFQ

36-3503-30

データシート

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-0503-21

21-0503-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics
3,042 -

RFQ

21-0503-21

データシート

Bulk 0503 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
21-0503-31

21-0503-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics
3,165 -

RFQ

21-0503-31

データシート

Bulk 0503 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
Total 4324 Record«Prev1... 127128129130131132133134...217Next»
1500+
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20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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