IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
33-0501-21

33-0501-21

CONN SOCKET SIP 33POS GOLD

Aries Electronics
3,489 -

RFQ

33-0501-21

データシート

Bulk 501 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
33-0501-31

33-0501-31

CONN SOCKET SIP 33POS GOLD

Aries Electronics
2,225 -

RFQ

33-0501-31

データシート

Bulk 501 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-0508-21

28-0508-21

CONN SOCKET SIP 28POS GOLD

Aries Electronics
2,659 -

RFQ

28-0508-21

データシート

Bulk 508 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
28-0508-31

28-0508-31

CONN SOCKET SIP 28POS GOLD

Aries Electronics
2,619 -

RFQ

28-0508-31

データシート

Bulk 508 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
28-1508-21

28-1508-21

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,319 -

RFQ

28-1508-21

データシート

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
28-1508-31

28-1508-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,392 -

RFQ

28-1508-31

データシート

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
160-PGM15050-10

160-PGM15050-10

CONN SOCKET PGA GOLD

Aries Electronics
2,896 -

RFQ

160-PGM15050-10

データシート

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
160-PGM15056-10

160-PGM15056-10

CONN SOCKET PGA GOLD

Aries Electronics
2,666 -

RFQ

160-PGM15056-10

データシート

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
64-9518-11H

64-9518-11H

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
2,730 -

RFQ

64-9518-11H

データシート

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6508-302

40-6508-302

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,891 -

RFQ

40-6508-302

データシート

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6621-30

32-6621-30

CONN IC DIP SOCKET 32POS TIN

Aries Electronics
2,863 -

RFQ

32-6621-30

データシート

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
44-6556-11

44-6556-11

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics
2,078 -

RFQ

44-6556-11

データシート

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
22-6503-21

22-6503-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,639 -

RFQ

22-6503-21

データシート

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6503-31

22-6503-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
3,482 -

RFQ

22-6503-31

データシート

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-21

24-6503-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,495 -

RFQ

24-6503-21

データシート

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-31

24-6503-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,026 -

RFQ

24-6503-31

データシート

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-6823-90T

38-6823-90T

CONN IC DIP SOCKET 38POS TIN

Aries Electronics
2,942 -

RFQ

38-6823-90T

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-0501-21

28-0501-21

CONN SOCKET SIP 28POS GOLD

Aries Electronics
3,321 -

RFQ

28-0501-21

データシート

Bulk 501 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-0501-31

28-0501-31

CONN SOCKET SIP 28POS GOLD

Aries Electronics
2,416 -

RFQ

28-0501-31

データシート

Bulk 501 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
37-0501-20

37-0501-20

CONN SOCKET SIP 37POS TIN

Aries Electronics
2,119 -

RFQ

37-0501-20

データシート

Bulk 501 Active SIP 37 (1 x 37) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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