IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
84-PRS10003-12

84-PRS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,437 -

RFQ

84-PRS10003-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS11032-12

84-PRS11032-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,727 -

RFQ

84-PRS11032-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS12022-12

84-PRS12022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,325 -

RFQ

84-PRS12022-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS13053-12

84-PRS13053-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,445 -

RFQ

84-PRS13053-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS13125-12

84-PRS13125-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,250 -

RFQ

84-PRS13125-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
18-PRS17041-12

18-PRS17041-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,532 -

RFQ

18-PRS17041-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
56-PRS15057-12

56-PRS15057-12

ZIF PGA SOCKET 56PIN 15X15

Aries Electronics
3,488 -

RFQ

- PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
56-PLS14031-12

56-PLS14031-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,845 -

RFQ

56-PLS14031-12

データシート

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
56-PLS15057-12

56-PLS15057-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,763 -

RFQ

56-PLS15057-12

データシート

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
56-PRS14031-12

56-PRS14031-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,278 -

RFQ

56-PRS14031-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
44-6552-16

44-6552-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics
3,103 -

RFQ

44-6552-16

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3554-16

44-3554-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics
2,682 -

RFQ

44-3554-16

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6553-16

44-6553-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics
2,098 -

RFQ

44-6553-16

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3551-16

44-3551-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics
2,446 -

RFQ

44-3551-16

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3552-16

44-3552-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics
3,933 -

RFQ

44-3552-16

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3553-16

44-3553-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics
2,330 -

RFQ

44-3553-16

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6551-16

44-6551-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics
3,848 -

RFQ

44-6551-16

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6554-16

44-6554-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics
2,252 -

RFQ

44-6554-16

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
85-PRS11008-12

85-PRS11008-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,718 -

RFQ

85-PRS11008-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
101-PRS13022-12

101-PRS13022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,001 -

RFQ

101-PRS13022-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
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15,000+ 在庫倉庫
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