IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1109704

1109704

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
2,769 -

RFQ

1109704

データシート

- - Active - - - - - - - - - - - - - -
1110134

1110134

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,937 -

RFQ

1110134

データシート

- - Active - - - - - - - - - - - - - -
2485-111-13

2485-111-13

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,379 -

RFQ

2485-111-13

データシート

- - Active - - - - - - - - - - - - - -
2552-111-13

2552-111-13

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,084 -

RFQ

2552-111-13

データシート

- - Active - - - - - - - - - - - - - -
34-6823-90

34-6823-90

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,285 -

RFQ

34-6823-90

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
34-6823-90T

34-6823-90T

CONN IC DIP SOCKET 34POS TIN

Aries Electronics
3,170 -

RFQ

34-6823-90T

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
4847-111-13

4847-111-13

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,996 -

RFQ

4847-111-13

データシート

- - Active - - - - - - - - - - - - - -
1105572

1105572

800 VERTISOCKET VERTICAL MOUNT

Aries Electronics
2,469 -

RFQ

1105572

データシート

- - Active - - - - - - - - - - - - - -
1108680

1108680

800 VERTISOCKET VERTICAL MOUNT

Aries Electronics
2,357 -

RFQ

1108680

データシート

- - Active - - - - - - - - - - - - - -
1110137

1110137

800 VERTISOCKET VERTICAL MOUNT

Aries Electronics
2,378 -

RFQ

1110137

データシート

- - Active - - - - - - - - - - - - - -
1110221

1110221

800 VERTISOCKET VERTICAL MOUNT

Aries Electronics
2,819 -

RFQ

1110221

データシート

- - Active - - - - - - - - - - - - - -
1106275-16

1106275-16

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
2,959 -

RFQ

1106275-16

データシート

- - Active - - - - - - - - - - - - - -
1106275-20

1106275-20

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
2,342 -

RFQ

1106275-20

データシート

- - Active - - - - - - - - - - - - - -
1109785

1109785

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
2,829 -

RFQ

1109785

データシート

- - Active - - - - - - - - - - - - - -
34-6820-90C

34-6820-90C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,121 -

RFQ

34-6820-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-6822-90C

34-6822-90C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,120 -

RFQ

34-6822-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-6823-90C

34-6823-90C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
2,234 -

RFQ

34-6823-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-81000-10

14-81000-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
3,813 -

RFQ

14-81000-10

データシート

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-81100-10

14-81100-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
2,361 -

RFQ

14-81100-10

データシート

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-81187-10

14-81187-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
2,366 -

RFQ

14-81187-10

データシート

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Record«Prev1... 208209210211212213214215...217Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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