IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
11-7400-10

11-7400-10

CONN SOCKET SIP 11POS TIN

Aries Electronics
3,287 -

RFQ

11-7400-10

データシート

Bulk 700 Elevator Strip-Line™ Active SIP 11 (1 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-7587-10

11-7587-10

CONN SOCKET SIP 11POS TIN

Aries Electronics
2,751 -

RFQ

11-7587-10

データシート

Bulk 700 Elevator Strip-Line™ Active SIP 11 (1 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-6621-30

08-6621-30

CONN IC DIP SOCKET 8POS TIN

Aries Electronics
3,894 -

RFQ

08-6621-30

データシート

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-111

40-6518-111

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,215 -

RFQ

40-6518-111

データシート

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0517-90C

25-0517-90C

CONN SOCKET SIP 25POS GOLD

Aries Electronics
2,395 -

RFQ

25-0517-90C

データシート

Bulk 0517 Active SIP 25 (1 x 25) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0501-20

14-0501-20

CONN SOCKET SIP 14POS TIN

Aries Electronics
2,330 -

RFQ

14-0501-20

データシート

Bulk 501 Active SIP 14 (1 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-0501-30

14-0501-30

CONN SOCKET SIP 14POS TIN

Aries Electronics
2,466 -

RFQ

14-0501-30

データシート

Bulk 501 Active SIP 14 (1 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-9513-11

30-9513-11

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,341 -

RFQ

30-9513-11

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0508-21

13-0508-21

CONN SOCKET SIP 13POS GOLD

Aries Electronics
3,304 -

RFQ

13-0508-21

データシート

Bulk 508 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
13-0508-31

13-0508-31

CONN SOCKET SIP 13POS GOLD

Aries Electronics
2,498 -

RFQ

13-0508-31

データシート

Bulk 508 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
18-3508-201

18-3508-201

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,578 -

RFQ

18-3508-201

データシート

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3508-301

18-3508-301

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
3,395 -

RFQ

18-3508-301

データシート

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6823-90

14-6823-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
3,240 -

RFQ

14-6823-90

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
32-3513-10H

32-3513-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,359 -

RFQ

32-3513-10H

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3508-202

14-3508-202

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
3,063 -

RFQ

14-3508-202

データシート

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3508-302

14-3508-302

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
2,331 -

RFQ

14-3508-302

データシート

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6501-20

32-6501-20

CONN IC DIP SOCKET 32POS TIN

Aries Electronics
3,334 -

RFQ

32-6501-20

データシート

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6501-30

32-6501-30

CONN IC DIP SOCKET 32POS TIN

Aries Electronics
2,628 -

RFQ

32-6501-30

データシート

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3501-21

18-3501-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
3,137 -

RFQ

18-3501-21

データシート

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3501-31

18-3501-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
3,802 -

RFQ

18-3501-31

データシート

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Record«Prev1... 8182838485868788...217Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
日文版

ホーム

日文版

製品

日文版

電話

日文版

ユーザー

Tipsχ