IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-99-632-61-001000

110-99-632-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,518 -

RFQ

Tube * Active - - - - - - - - - - - - - -
117-43-642-41-105000

117-43-642-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,648 -

RFQ

117-43-642-41-105000

データシート

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-328-41-002000

124-93-328-41-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,690 -

RFQ

124-93-328-41-002000

データシート

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-428-41-002000

124-93-428-41-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,503 -

RFQ

124-93-428-41-002000

データシート

Tube 124 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-432-41-001000

614-41-432-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,444 -

RFQ

614-41-432-41-001000

データシート

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-632-41-001000

614-41-632-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,711 -

RFQ

614-41-632-41-001000

データシート

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-432-41-001000

614-91-432-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,225 -

RFQ

614-91-432-41-001000

データシート

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-632-41-001000

614-91-632-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,992 -

RFQ

614-91-632-41-001000

データシート

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-642-41-003000

116-41-642-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,496 -

RFQ

116-41-642-41-003000

データシート

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-642-41-003000

116-91-642-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,915 -

RFQ

116-91-642-41-003000

データシート

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-262-31-018000

714-43-262-31-018000

CONN IC DIP SOCKET 62POS GOLD

Mill-Max Manufacturing Corp.
2,085 -

RFQ

714-43-262-31-018000

データシート

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 62 (2 x 31) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-652-41-001000

110-11-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,682 -

RFQ

110-11-652-41-001000

データシート

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-950-41-003000

116-41-950-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,155 -

RFQ

116-41-950-41-003000

データシート

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-950-41-003000

116-91-950-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,729 -

RFQ

116-91-950-41-003000

データシート

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-432-41-001000

122-11-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,182 -

RFQ

122-11-432-41-001000

データシート

Tube 122 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-632-41-001000

122-11-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,719 -

RFQ

122-11-632-41-001000

データシート

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-648-31-018000

614-41-648-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,052 -

RFQ

614-41-648-31-018000

データシート

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-648-31-018000

614-91-648-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,104 -

RFQ

614-91-648-31-018000

データシート

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-324-41-001000

121-13-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,363 -

RFQ

121-13-324-41-001000

データシート

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-424-41-001000

121-13-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,503 -

RFQ

121-13-424-41-001000

データシート

Tube 121 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 197198199200201202203204...608Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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