IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-3574-11

32-3574-11

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics
2,531 -

RFQ

32-3574-11

データシート

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
110-43-964-61-001000

110-43-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,208 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-964-61-001000

110-93-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,450 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-43-652-61-105000

110-43-652-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,625 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-43-952-61-105000

110-43-952-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,774 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-652-61-105000

110-93-652-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,994 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-952-61-105000

110-93-952-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,648 -

RFQ

Tube * Active - - - - - - - - - - - - - -
326-93-164-41-002000

326-93-164-41-002000

SOCKET WRAP SOLDERTAIL SIP 64POS

Mill-Max Manufacturing Corp.
2,259 -

RFQ

326-93-164-41-002000

データシート

Tube 326 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-636-61-007000

116-43-636-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,351 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-636-61-007000

116-93-636-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,977 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-13-650-61-001000

110-13-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,832 -

RFQ

Tube * Active - - - - - - - - - - - - - -
324-93-164-41-002000

324-93-164-41-002000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.
2,228 -

RFQ

324-93-164-41-002000

データシート

Tube 324 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-964-41-002000

124-93-964-41-002000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.
3,644 -

RFQ

124-93-964-41-002000

データシート

Tube 124 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-964-41-002000

124-43-964-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,538 -

RFQ

124-43-964-41-002000

データシート

Tube 124 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-81000-310C

40-81000-310C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,757 -

RFQ

40-81000-310C

データシート

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-81000-610C

40-81000-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,170 -

RFQ

40-81000-610C

データシート

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-81150-610C

40-81150-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,581 -

RFQ

40-81150-610C

データシート

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-81250-310C

40-81250-310C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,394 -

RFQ

40-81250-310C

データシート

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-81250-610C

40-81250-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,229 -

RFQ

40-81250-610C

データシート

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8260-610C

40-8260-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,961 -

RFQ

40-8260-610C

データシート

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 622623624625626627628629...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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