IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-159-16-105002

510-13-159-16-105002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,140 -

RFQ

510-13-159-16-105002

データシート

Bulk 510 Active PGA 159 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-159-16-105003

510-13-159-16-105003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,439 -

RFQ

510-13-159-16-105003

データシート

Bulk 510 Active PGA 159 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-360M19-001101

558-10-360M19-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
2,777 -

RFQ

558-10-360M19-001101

データシート

Bulk 558 Active PGA 360 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
32-6556-40

32-6556-40

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
3,567 -

RFQ

32-6556-40

データシート

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
510-13-161-15-005001

510-13-161-15-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,503 -

RFQ

510-13-161-15-005001

データシート

Bulk 510 Active PGA 161 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-161-15-005002

510-13-161-15-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,816 -

RFQ

510-13-161-15-005002

データシート

Bulk 510 Active PGA 161 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-161-15-005003

510-13-161-15-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,569 -

RFQ

510-13-161-15-005003

データシート

Bulk 510 Active PGA 161 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-83-388M26-001148

514-83-388M26-001148

CONN SOCKET BGA 388POS GOLD

Preci-Dip
3,399 -

RFQ

514-83-388M26-001148

データシート

Bulk 514 Active BGA 388 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-93-299-20-096001

510-93-299-20-096001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,286 -

RFQ

510-93-299-20-096001

データシート

Bulk 510 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-299-20-096002

510-93-299-20-096002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,234 -

RFQ

510-93-299-20-096002

データシート

Tube 510 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-299-20-096003

510-93-299-20-096003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,313 -

RFQ

510-93-299-20-096003

データシート

Bulk 510 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
192-PGM17025-11

192-PGM17025-11

CONN SOCKET PGA GOLD

Aries Electronics
2,862 -

RFQ

192-PGM17025-11

データシート

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-91-361-19-000002

510-91-361-19-000002

SOCKET SOLDERTAIL 361-PGA

Mill-Max Manufacturing Corp.
2,370 -

RFQ

Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-361-19-000001

510-91-361-19-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,265 -

RFQ

510-91-361-19-000001

データシート

Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-361-19-000003

510-91-361-19-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,215 -

RFQ

510-91-361-19-000003

データシート

Bulk 510 Active PGA 361 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-43-281-19-081002

510-43-281-19-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,280 -

RFQ

510-43-281-19-081002

データシート

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-528-21-121147

546-87-528-21-121147

CONN SOCKET PGA 528POS GOLD

Preci-Dip
3,755 -

RFQ

546-87-528-21-121147

データシート

Bulk 546 Active PGA 528 (21 x 21) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-388M26-001152

550-10-388M26-001152

BGA SOLDER TAIL

Preci-Dip
3,935 -

RFQ

550-10-388M26-001152

データシート

Bulk 550 Active BGA 388 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
6-1437522-9

6-1437522-9

STAMPED PIN

TE Connectivity AMP Connectors
2,408 -

RFQ

Bulk,Bulk - Active - - - - - - - - - - - - - -
84-PGM13042-10T

84-PGM13042-10T

CONN SOCKET PGA TIN

Aries Electronics
2,236 -

RFQ

84-PGM13042-10T

データシート

Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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