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| 写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
514-83-478M26-131148CONN SOCKET BGA 478POS GOLD Preci-Dip |
3,036 | - |
RFQ |
データシート |
Bulk | 514 | Active | BGA | 478 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-13-225-15-000002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,600 | - |
RFQ |
データシート |
Bulk | 510 | Active | PGA | 225 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-225-15-000001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,890 | - |
RFQ |
データシート |
Bulk | 510 | Active | PGA | 225 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-225-15-000003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,652 | - |
RFQ |
データシート |
Bulk | 510 | Active | PGA | 225 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-225-18-091001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,591 | - |
RFQ |
データシート |
Bulk | 510 | Active | PGA | 225 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-225-18-091002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,997 | - |
RFQ |
データシート |
Bulk | 510 | Active | PGA | 225 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-225-18-091003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,211 | - |
RFQ |
データシート |
Bulk | 510 | Active | PGA | 225 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
514-87-600M35-001148CONN SOCKET BGA 600POS GOLD Preci-Dip |
3,064 | - |
RFQ |
データシート |
Bulk | 514 | Active | BGA | 600 (35 x 35) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-480M29-001148CONN SOCKET BGA 480POS GOLD Preci-Dip |
2,690 | - |
RFQ |
データシート |
Bulk | 514 | Active | BGA | 480 (29 x 29) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-478M26-131152BGA SOLDER TAIL Preci-Dip |
2,256 | - |
RFQ |
データシート |
Bulk | 550 | Active | BGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
44-3573-16CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
3,211 | - |
RFQ |
データシート |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
550-10-480M29-001152BGA SOLDER TAIL Preci-Dip |
3,285 | - |
RFQ |
データシート |
Bulk | 550 | Active | BGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
36-6556-41CONN IC DIP SOCKET 36POS GOLD Aries Electronics |
2,793 | - |
RFQ |
データシート |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
121-PGM13012-10TCONN SOCKET PGA TIN Aries Electronics |
2,111 | - |
RFQ |
データシート |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
281-PGM18037-11CONN SOCKET PGA GOLD Aries Electronics |
2,176 | - |
RFQ |
データシート |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
558-10-456M26-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,546 | - |
RFQ |
データシート |
Bulk | 558 | Active | PGA | 456 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-420M26-001106CONN SOCKET PGA 420POS GOLD Preci-Dip |
2,203 | - |
RFQ |
データシート |
Bulk | 518 | Active | PGA | 420 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
40-6556-40CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
3,378 | - |
RFQ |
データシート |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
558-10-432M31-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,280 | - |
RFQ |
データシート |
Bulk | 558 | Active | BGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
42-6574-16CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics |
3,267 | - |
RFQ |
データシート |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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- 1800+ 世界中のメーカー
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