IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
163-PGM15066-10T

163-PGM15066-10T

CONN SOCKET PGA TIN

Aries Electronics
3,833 -

RFQ

163-PGM15066-10T

データシート

Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
163-PGM15067-10T

163-PGM15067-10T

CONN SOCKET PGA TIN

Aries Electronics
2,528 -

RFQ

163-PGM15067-10T

データシート

Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
558-10-560M33-001104

558-10-560M33-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
3,140 -

RFQ

558-10-560M33-001104

データシート

Bulk 558 Active BGA 560 (33 x 33) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-560M33-001105

518-77-560M33-001105

CONN SOCKET PGA 560POS GOLD

Preci-Dip
2,115 -

RFQ

518-77-560M33-001105

データシート

Bulk 518 Active PGA 560 (33 x 33) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-600M35-001101

558-10-600M35-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
3,156 -

RFQ

558-10-600M35-001101

データシート

Bulk 558 Active PGA 600 (35 x 35) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
65-PRS10008-12

65-PRS10008-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,435 -

RFQ

65-PRS10008-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
65-PRS11037-12

65-PRS11037-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,706 -

RFQ

65-PRS11037-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
66-PLS11049-12

66-PLS11049-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,226 -

RFQ

66-PLS11049-12

データシート

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
225-PGM15001-51

225-PGM15001-51

CONN SOCKET PGA GOLD

Aries Electronics
2,010 -

RFQ

225-PGM15001-51

データシート

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
66-PRS11054-12

66-PRS11054-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,374 -

RFQ

66-PRS11054-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
66-PLS11054-12

66-PLS11054-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,841 -

RFQ

66-PLS11054-12

データシート

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
518-77-560M33-001106

518-77-560M33-001106

CONN SOCKET PGA 560POS GOLD

Preci-Dip
2,081 -

RFQ

518-77-560M33-001106

データシート

Bulk 518 Active PGA 560 (33 x 33) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
68-PRS11033-12

68-PRS11033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,884 -

RFQ

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
68-PLS11033-12

68-PLS11033-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,177 -

RFQ

68-PLS11033-12

データシート

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
69-PLS11031-12

69-PLS11031-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,231 -

RFQ

69-PLS11031-12

データシート

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
69-PLS13112-12

69-PLS13112-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,627 -

RFQ

69-PLS13112-12

データシート

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
69-PRS11031-12

69-PRS11031-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,440 -

RFQ

69-PRS11031-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
69-PRS11055-12

69-PRS11055-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,321 -

RFQ

69-PRS11055-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
69-PRS13112-12

69-PRS13112-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,286 -

RFQ

69-PRS13112-12

データシート

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
514-83-652M35-001148

514-83-652M35-001148

CONN SOCKET BGA 652POS GOLD

Preci-Dip
3,465 -

RFQ

514-83-652M35-001148

データシート

Bulk 514 Active BGA 652 (35 x 35) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ 日平均RFQ
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20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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