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| 写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR48-HZL-TTCONN IC DIP SOCKET 48POS TIN Assmann WSW Components |
3,173 | - |
RFQ |
データシート |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR64-HZL-TTCONN IC DIP SOCKET 64POS TIN Assmann WSW Components |
2,532 | - |
RFQ |
データシート |
Bag | - | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
216-6278-00-3303CONN IC DIP SOCKET ZIF 16POS GLD 3M |
3,139 | - |
RFQ |
データシート |
Tube | OEM | Obsolete | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled |
|
220-4842-00-3303CONN IC DIP SOCKET ZIF 20POS GLD 3M |
2,100 | - |
RFQ |
データシート |
Bulk | OEM | Obsolete | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled |
|
|
240-4846-00-3303CONN IC DIP SOCKET ZIF 40POS GLD 3M |
3,085 | - |
RFQ |
データシート |
Bulk | OEM | Obsolete | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled |
|
28-536-11CONN SOCKET PLCC ZIF 28POS GOLD Aries Electronics |
3,123 | - |
RFQ |
- | 536 | Obsolete | PLCC, ZIF (ZIP) | 28 (4 x 7) | 0.050 (1.27mm) | Gold | 12.0µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | |
|
44-536-11CONN SOCKET PLCC ZIF 44POS GOLD Aries Electronics |
2,361 | - |
RFQ |
- | 536 | Obsolete | PLCC, ZIF (ZIP) | 44 (4 x 11) | 0.050 (1.27mm) | Gold | 12.0µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | |
|
68-536-11CONN SOCKET PLCC ZIF 68POS GOLD Aries Electronics |
2,434 | - |
RFQ |
- | 536 | Obsolete | PLCC, ZIF (ZIP) | 68 (4 x 17) | 0.050 (1.27mm) | Gold | 12.0µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | |
|
84-536-11CONN SOCKET PLCC ZIF 84POS GOLD Aries Electronics |
3,086 | - |
RFQ |
- | 536 | Obsolete | PLCC, ZIF (ZIP) | 84 (4 x 21) | 0.050 (1.27mm) | Gold | 12.0µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | |
|
|
523-93-168-17-101002PGA SOCK 168 PIN 17X17 WIRE WD Mill-Max Manufacturing Corp. |
2,130 | - |
RFQ |
データシート |
Bulk | 523 | Active | PGA | 168 (17 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
523-93-169-17-101002PGA SOCK 169 PIN 17X17 WIRE WD Mill-Max Manufacturing Corp. |
3,391 | - |
RFQ |
データシート |
Bulk | 523 | Active | PGA | 169 (17 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
C9314-02CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
2,567 | - |
RFQ |
データシート |
Bulk | Lo-PRO®file, C93 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
0009483031CONN SOCKET TRANSIST TO-220 3POS Molex |
2,660 | - |
RFQ |
データシート |
Bulk | - | Obsolete | Transistor, TO-220 | 3 (Rectangular) | - | Tin | 100.0µin (2.54µm) | Brass | Through Hole | Closed Frame | Solder | - | Tin | 100.0µin (2.54µm) | Brass | Polyamide (PA66), Nylon 6/6 |
|
0010182031CONN SOCKET TRANSIST TO-220 3POS Molex |
3,600 | - |
RFQ |
データシート |
- | 4038 | Obsolete | Transistor, TO-220 | 3 (Rectangular) | 0.100 (2.54mm) | Tin | - | Brass | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Brass | Polyester, Glass Filled |
|
|
0050395288CONN IC DIP SOCKET 28POS TINLEAD Molex |
2,020 | - |
RFQ |
データシート |
- | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin-Lead | - | - | Through Hole | Closed Frame | - | - | - | - | - | - |
|
52-536-11CONN SOCKET PLCC ZIF 52POS GOLD Aries Electronics |
3,298 | - |
RFQ |
- | 536 | Obsolete | PLCC, ZIF (ZIP) | 52 (4 x 13) | 0.050 (1.27mm) | Gold | 12.0µin (0.30µm) | - | Through Hole | Open Frame | - | - | - | - | - | - | |
|
|
2100-7243-00-1807CONN SOCKET PQFP 100POS TIN-LEAD 3M |
2,431 | - |
RFQ |
データシート |
Bulk | OEM | Obsolete | QFP | 100 (4 x 25) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Open Frame | Solder | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
268-5401-00-1102JHCONN SOCKET CLCC 68POS GOLD 3M |
2,262 | - |
RFQ |
データシート |
Tray | OEM | Obsolete | CLCC | 68 (4 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
268-5401-11-1102JHCONN SOCKET CLCC 68POS GOLD 3M |
2,015 | - |
RFQ |
データシート |
Bulk | OEM | Obsolete | CLCC | 68 (4 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
268-5401-50-1102JHCONN SOCKET CLCC 68POS GOLD 3M |
3,289 | - |
RFQ |
データシート |
Bulk | OEM | Obsolete | CLCC | 68 (4 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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- 1800+ 世界中のメーカー
- 15,000+ 在庫倉庫
