写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1825109-3CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors |
2,120 | - |
RFQ |
![]() データシート |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
![]() |
1825276-2CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors |
2,652 | - |
RFQ |
![]() データシート |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
![]() |
1825376-2CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors |
2,901 | - |
RFQ |
![]() データシート |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-821949-4CONN SOCKET PQFP 100POS TIN-LEAD TE Connectivity AMP Connectors |
2,548 | - |
RFQ |
![]() データシート |
Tube | - | Obsolete | QFP | 100 (4 x 25) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
![]() |
110-024-000CONN IC DIP SOCKET 24POS GOLD 3M |
2,036 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
![]() |
130-024-000CONN IC DIP SOCKET 24POS GOLD 3M |
2,535 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
![]() |
130-028-000CONN IC DIP SOCKET 28POS GOLD 3M |
2,568 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
![]() |
300-014-000CONN SOCKET SIP 14POS GOLD 3M |
3,234 | - |
RFQ |
- | 300 | Obsolete | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
![]() |
300-032-000CONN SOCKET SIP 32POS GOLD 3M |
2,468 | - |
RFQ |
- | 300 | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
![]() |
400-028-000CONN IC DIP SOCKET 28POS GOLD 3M |
2,636 | - |
RFQ |
- | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
![]() |
400-032-000CONN IC DIP SOCKET 32POS GOLD 3M |
3,776 | - |
RFQ |
- | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
![]() |
400-040-000CONN IC DIP SOCKET 40POS GOLD 3M |
2,974 | - |
RFQ |
- | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
![]() |
500-032-000CONN SOCKET SIP 32POS GOLD 3M |
3,542 | - |
RFQ |
- | - | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
![]() |
210-33-628-41-101000SOCKET IC CLOSED FRM .300 28POS Mill-Max Manufacturing Corp. |
2,785 | - |
RFQ |
Tube | 210 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
![]() |
210-33-640-41-101000SOCKET IC CLOSED FRM .600 28POS Mill-Max Manufacturing Corp. |
3,301 | - |
RFQ |
Tube | 210 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
![]() |
SIP1X06-014BLFCONN SOCKET SIP 6POS TIN Amphenol ICC (FCI) |
2,152 | - |
RFQ |
![]() データシート |
Bulk | SIP1x | Obsolete | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
![]() |
SIP1X05-014BLFCONN SOCKET SIP 5POS TIN Amphenol ICC (FCI) |
2,853 | - |
RFQ |
![]() データシート |
Bulk | SIP1x | Obsolete | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
![]() |
SIP1X08-011BLFCONN SOCKET SIP 8POS GOLD Amphenol ICC (FCI) |
3,812 | - |
RFQ |
![]() データシート |
Bulk | SIP1x | Obsolete | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
![]() |
SIP1X07-014BLFCONN SOCKET SIP 7POS TIN Amphenol ICC (FCI) |
2,500 | - |
RFQ |
![]() データシート |
Bulk | SIP1x | Obsolete | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
![]() |
SIP1X06-011BLFCONN SOCKET SIP 6POS GOLD Amphenol ICC (FCI) |
3,065 | - |
RFQ |
![]() データシート |
Bulk | SIP1x | Obsolete | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |