IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
2-641260-4

2-641260-4

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
3,331 -

RFQ

2-641260-4

データシート

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
2-641262-1

2-641262-1

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors
3,469 -

RFQ

2-641262-1

データシート

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-640464-2

2-640464-2

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
3,353 -

RFQ

2-640464-2

データシート

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
2-641267-1

2-641267-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
2,356 -

RFQ

2-641267-1

データシート

Tube,Box Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-640362-2

2-640362-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,610 -

RFQ

2-640362-2

データシート

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
2-640358-2

2-640358-2

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
2,928 -

RFQ

2-640358-2

データシート

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
2-640361-2

2-640361-2

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
2,810 -

RFQ

2-640361-2

データシート

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic
2-640379-2

2-640379-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,268 -

RFQ

2-640379-2

データシート

Tube Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
2-640463-2

2-640463-2

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors
3,906 -

RFQ

2-640463-2

データシート

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
2-641267-3

2-641267-3

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
3,730 -

RFQ

2-641267-3

データシート

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
2-641615-1

2-641615-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
2,929 -

RFQ

2-641615-1

データシート

Tube,Box Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-641606-2

2-641606-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,455 -

RFQ

2-641606-2

データシート

Tube,Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
2-641609-1

2-641609-1

CONN IC DIP SOCKET 14POS TIN

TE Connectivity AMP Connectors
2,490 -

RFQ

2-641609-1

データシート

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-641610-1

2-641610-1

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors
2,082 -

RFQ

2-641610-1

データシート

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper -
2-641605-2

2-641605-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
2,941 -

RFQ

2-641605-2

データシート

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
2-641612-1

2-641612-1

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors
2,460 -

RFQ

2-641612-1

データシート

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic
2-641605-4

2-641605-4

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
3,479 -

RFQ

2-641605-4

データシート

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled
2-641268-1

2-641268-1

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors
2,011 -

RFQ

2-641268-1

データシート

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-641296-2

2-641296-2

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
3,620 -

RFQ

2-641296-2

データシート

Tube,Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
2-641599-2

2-641599-2

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
2,069 -

RFQ

2-641599-2

データシート

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled
Total 955 Record«Prev1... 678910111213...48Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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