IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1-822473-1

1-822473-1

CONN SOCKET PLCC 20POS TIN

TE Connectivity AMP Connectors
3,432 -

RFQ

1-822473-1

データシート

Tube - Obsolete PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic
1-382568-6

1-382568-6

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors
2,738 -

RFQ

1-382568-6

データシート

Box Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
2-382568-5

2-382568-5

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors
3,338 -

RFQ

2-382568-5

データシート

Box Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
2-382713-1

2-382713-1

CONN IC DIP SOCKET 18POS TIN

TE Connectivity AMP Connectors
2,476 -

RFQ

2-382713-1

データシート

Box Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-382713-3

2-382713-3

CONN IC DIP SOCKET 18POS TIN

TE Connectivity AMP Connectors
2,364 -

RFQ

2-382713-3

データシート

Box Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
2-382713-6

2-382713-6

CONN IC DIP SOCKET 18POS TIN

TE Connectivity AMP Connectors
2,396 -

RFQ

2-382713-6

データシート

Box Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-382713-8

2-382713-8

CONN IC DIP SOCKET 18POS TIN

TE Connectivity AMP Connectors
2,885 -

RFQ

2-382713-8

データシート

Box Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
2-382718-3

2-382718-3

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
3,236 -

RFQ

2-382718-3

データシート

Box Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
2-382718-8

2-382718-8

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
3,528 -

RFQ

2-382718-8

データシート

Box Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
2-382724-1

2-382724-1

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors
3,932 -

RFQ

2-382724-1

データシート

Box Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-382724-3

2-382724-3

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors
3,076 -

RFQ

2-382724-3

データシート

Box Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
2-382724-6

2-382724-6

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors
3,584 -

RFQ

2-382724-6

データシート

Box Diplomate DL Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-382882-1

2-382882-1

CONN IC DIP SOCKET 6POS TIN

TE Connectivity AMP Connectors
2,693 -

RFQ

2-382882-1

データシート

Box Diplomate DL Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
641855-1

641855-1

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors
2,713 -

RFQ

641855-1

データシート

Box Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic
5-1437529-9

5-1437529-9

CONN IC DIP SOCKET 4POS GOLD

TE Connectivity AMP Connectors
3,484 -

RFQ

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Thermoplastic, Polyester
522-AG10D

522-AG10D

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors
3,282 -

RFQ

522-AG10D

データシート

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Copper Alloy -
7-1437532-6

7-1437532-6

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors
3,959 -

RFQ

7-1437532-6

データシート

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polyester
1-1437536-4

1-1437536-4

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors
3,948 -

RFQ

1-1437536-4

データシート

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Beryllium Copper -
7-1437536-1

7-1437536-1

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors
3,863 -

RFQ

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass -
824-AG10D

824-AG10D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors
3,473 -

RFQ

824-AG10D

データシート

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
Total 955 Record«Prev1... 2829303132333435...48Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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