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| 写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
579704B00000GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,170 | - |
RFQ |
データシート |
Bulk | - | Active | Board Level, Vertical | Clip | Rectangular, Fins | 0.900 (22.86mm) | 0.745 (18.92mm) | - | 0.420 (10.67mm) | 1.5W @ 40°C | 11.00°C/W @ 400 LFM | 24.00°C/W | Aluminum | |
|
|
626-10ABPEHEATSINK FOR TO218/TO220 Wakefield-Vette |
3,525 | - |
RFQ |
データシート |
Bulk | 626 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 0.500 (12.70mm) | 1.375 (34.93mm) | - | 1.000 (25.40mm) | 6.0W @ 76°C | 5.80°C/W @ 200 LFM | - | Aluminum | |
|
|
627-10ABPEHEATSINK FOR TO218/TO220 Wakefield-Vette |
3,117 | - |
RFQ |
データシート |
Bulk | 627 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 0.500 (12.70mm) | 1.375 (34.93mm) | - | 1.000 (25.40mm) | 6.0W @ 76°C | 5.80°C/W @ 200 LFM | - | Aluminum | |
|
|
566010B00000GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
3,010 | - |
RFQ |
データシート |
Bulk | - | Active | Board Level | Clip | Rectangular, Fins | 1.220 (30.99mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 3.0W @ 40°C | 4.00°C/W @ 300 LFM | 11.50°C/W | Aluminum | |
|
|
634-20ABHEATSINK TO-220 VERT MT BLK 2.0 Wakefield-Vette |
3,700 | - |
RFQ |
データシート |
Bulk | 634 | Active | Board Level, Vertical | Bolt On | Rectangular, Fins | 2.000 (50.80mm) | 0.640 (16.26mm) | - | 0.640 (16.26mm) | - | - | - | Aluminum | |
|
HSE-B18381-060H-WHEAT SINK, EXTRUSION, TO-218, 38 CUI Devices |
3,470 | - |
RFQ |
データシート |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 1.500 (38.10mm) | 1.638 (41.60mm) | - | 0.984 (25.00mm) | 12.0W @ 75°C | 3.52°C/W @ 200 LFM | 6.25°C/W | Aluminum Alloy | |
|
|
624-45ABT1EHEATSINK FOR 21MM BGA Wakefield-Vette |
2,248 | - |
RFQ |
データシート |
Bulk | 624 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.450 (11.43mm) | - | 15.00°C/W @ 200 LFM | - | Aluminum | |
|
|
630-25ABT1EHEATSINK FOR 35MM BGA Wakefield-Vette |
2,829 | - |
RFQ |
データシート |
Bulk | 630 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.250 (6.35mm) | - | 7.00°C/W @ 500 LFM | - | Aluminum | |
|
|
626-15ABPEHEATSINK FOR TO218/TO220 Wakefield-Vette |
3,404 | - |
RFQ |
データシート |
Bulk | 626 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 0.500 (12.70mm) | 1.375 (34.93mm) | - | 1.500 (38.10mm) | 6.0W @ 65°C | 5.50°C/W @ 200 LFM | - | Aluminum | |
|
|
627-20ABPEHEATSINK FOR TO218/TO220 Wakefield-Vette |
2,531 | - |
RFQ |
データシート |
Bulk | 627 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 0.500 (12.70mm) | 1.375 (34.93mm) | - | 2.000 (50.80mm) | 6.0W @ 55°C | 4.70°C/W @ 200 LFM | - | Aluminum | |
|
HSE-B18317-035HHEAT SINK, EXTRUSION, TO-218, 31 CUI Devices |
2,443 | - |
RFQ |
データシート |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Angled Fins | 1.250 (31.75mm) | 1.638 (41.60mm) | - | 0.984 (25.00mm) | 9.8W @ 75°C | 3.63°C/W @ 200 LFM | 7.65°C/W | Aluminum Alloy | |
|
|
624-35ABT3HEATSINK FOR 21MM BGA Wakefield-Vette |
2,621 | - |
RFQ |
データシート |
Bulk | 624 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.350 (8.89mm) | - | 15.00°C/W @ 400 LFM | - | Aluminum | |
|
|
625-35ABT1EHEATSINK FOR 25MM BGA Wakefield-Vette |
3,778 | - |
RFQ |
データシート |
Bulk | 625 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.984 (25.00mm) | 0.984 (25.00mm) | - | 0.350 (8.89mm) | - | 1.00°C/W @ 400 LFM | - | Aluminum | |
|
|
642-35ABT4EHEATSINK FOR 35MM BGA Wakefield-Vette |
3,025 | - |
RFQ |
データシート |
Bulk | 642 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.350 (8.89mm) | - | 8.00°C/W @ 400 LFM | - | Aluminum | |
|
|
642-45ABT1EHEATSINK FOR 35MM BGA Wakefield-Vette |
3,792 | - |
RFQ |
データシート |
Bulk | 642 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.450 (11.43mm) | - | 6.00°C/W @ 500 LFM | - | Aluminum | |
|
|
624-60ABT1EHEATSINK FOR 21MM BGA Wakefield-Vette |
3,886 | - |
RFQ |
データシート |
Bulk | 624 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.600 (15.24mm) | - | 1.00°C/W @ 400 LFM | - | Aluminum | |
|
|
628-35ABHEATSINK FOR 45MM BGA Wakefield-Vette |
2,053 | - |
RFQ |
データシート |
Bulk | 628 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.750 (44.45mm) | 1.700 (43.18mm) | - | 0.350 (8.89mm) | 3.0W @ 50°C | 10.00°C/W @ 150 LFM | - | Aluminum | |
|
|
HSE-B18508-035H-03HEAT SINK, EXTRUSION, TO-218, 50 CUI Devices |
2,606 | - |
RFQ |
データシート |
Box | HSE | Active | Board Level, Vertical | Clip and PC Pin | Rectangular, Angled Fins | 2.000 (50.80mm) | 1.638 (41.60mm) | - | 0.984 (25.00mm) | 13.0W @ 75°C | 3.44°C/W @ 200 LFM | 5.77°C/W | Aluminum Alloy | |
|
|
530001B02100GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,871 | - |
RFQ |
データシート |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 2.500 (63.50mm) | 1.650 (41.91mm) | - | 1.000 (25.40mm) | 20.0W @ 60°C | 1.00°C/W @ 800 LFM | 8.00°C/W | Aluminum | |
|
|
630-35ABT5HEATSINK FOR 35MM BGA Wakefield-Vette |
2,538 | - |
RFQ |
データシート |
Bulk | 630 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.378 (35.00mm) | 1.378 (35.00mm) | - | 0.350 (8.89mm) | - | 5.00°C/W @ 500 LFM | - | Aluminum |
- 1500+ 日平均RFQ
- 20,000.000 標準製品ユニット
- 1800+ 世界中のメーカー
- 15,000+ 在庫倉庫
