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| 写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
100-048-000CONN IC DIP SOCKET 48POS GOLD 3M |
2,324 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
4828-3000-CPCONN IC DIP SOCKET 28POS TIN 3M |
2,224 | - |
RFQ |
データシート |
Tube | 4800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
4824-3004-CPCONN IC DIP SOCKET 24POS TIN 3M |
2,147 | - |
RFQ |
データシート |
Tube | 4800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
|
110-024-000CONN IC DIP SOCKET 24POS GOLD 3M |
2,036 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
130-024-000CONN IC DIP SOCKET 24POS GOLD 3M |
2,535 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
130-028-000CONN IC DIP SOCKET 28POS GOLD 3M |
2,568 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
300-014-000CONN SOCKET SIP 14POS GOLD 3M |
3,234 | - |
RFQ |
- | 300 | Obsolete | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
|
|
300-032-000CONN SOCKET SIP 32POS GOLD 3M |
2,468 | - |
RFQ |
- | 300 | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
|
|
400-028-000CONN IC DIP SOCKET 28POS GOLD 3M |
2,636 | - |
RFQ |
- | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
|
|
400-032-000CONN IC DIP SOCKET 32POS GOLD 3M |
3,776 | - |
RFQ |
- | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
|
|
400-040-000CONN IC DIP SOCKET 40POS GOLD 3M |
2,974 | - |
RFQ |
- | 400 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Open Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
|
|
500-032-000CONN SOCKET SIP 32POS GOLD 3M |
3,542 | - |
RFQ |
- | - | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | - | - | |
|
|
100-006-050CONN IC DIP SOCKET 6POS GOLD 3M |
2,086 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-008-050CONN IC DIP SOCKET 8POS GOLD 3M |
3,451 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-008-051CONN IC DIP SOCKET 8POS GOLD 3M |
2,994 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-010-050CONN IC DIP SOCKET 10POS GOLD 3M |
2,619 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-014-050CONN IC DIP SOCKET 14POS GOLD 3M |
2,112 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-014-051CONN IC DIP SOCKET 14POS GOLD 3M |
2,703 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-016-050CONN IC DIP SOCKET 16POS GOLD 3M |
3,178 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-016-051CONN IC DIP SOCKET 16POS GOLD 3M |
3,783 | - |
RFQ |
データシート |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
- 1500+ 日平均RFQ
- 20,000.000 標準製品ユニット
- 1800+ 世界中のメーカー
- 15,000+ 在庫倉庫
