IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
100-018-050

100-018-050

CONN IC DIP SOCKET 18POS GOLD

3M
3,381 -

RFQ

100-018-050

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-018-051

100-018-051

CONN IC DIP SOCKET 18POS GOLD

3M
3,557 -

RFQ

100-018-051

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-020-050

100-020-050

CONN IC DIP SOCKET 20POS GOLD

3M
3,642 -

RFQ

100-020-050

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-020-051

100-020-051

CONN IC DIP SOCKET 20POS GOLD

3M
3,538 -

RFQ

100-020-051

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-022-050

100-022-050

CONN IC DIP SOCKET 22POS GOLD

3M
2,763 -

RFQ

100-022-050

データシート

Bulk 100 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-024-051

100-024-051

CONN IC DIP SOCKET 24POS GOLD

3M
3,201 -

RFQ

100-024-051

データシート

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-028-050

100-028-050

CONN IC DIP SOCKET 28POS GOLD

3M
3,718 -

RFQ

100-028-050

データシート

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-028-051

100-028-051

CONN IC DIP SOCKET 28POS GOLD

3M
2,985 -

RFQ

100-028-051

データシート

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-032-050

100-032-050

CONN IC DIP SOCKET 32POS GOLD

3M
3,772 -

RFQ

100-032-050

データシート

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-032-051

100-032-051

CONN IC DIP SOCKET 32POS GOLD

3M
3,906 -

RFQ

100-032-051

データシート

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-040-050

100-040-050

CONN IC DIP SOCKET 40POS GOLD

3M
2,211 -

RFQ

100-040-050

データシート

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-040-051

100-040-051

CONN IC DIP SOCKET 40POS GOLD

3M
3,341 -

RFQ

100-040-051

データシート

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-042-050

100-042-050

CONN IC DIP SOCKET 42POS GOLD

3M
2,068 -

RFQ

100-042-050

データシート

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-048-050

100-048-050

CONN IC DIP SOCKET 48POS GOLD

3M
2,320 -

RFQ

100-048-050

データシート

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
110-024-050

110-024-050

CONN IC DIP SOCKET 24POS GOLD

3M
3,393 -

RFQ

110-024-050

データシート

Bulk 100 Obsolete DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
130-024-050

130-024-050

CONN IC DIP SOCKET 24POS GOLD

3M
2,008 -

RFQ

130-024-050

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
130-028-050

130-028-050

CONN IC DIP SOCKET 28POS GOLD

3M
3,862 -

RFQ

130-028-050

データシート

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
300-032-050

300-032-050

CONN SOCKET SIP 32POS GOLD

3M
3,284 -

RFQ

Box 300 Obsolete SIP 32 (1 x 32) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
400-028-050

400-028-050

CONN IC DIP SOCKET 28POS GOLD

3M
2,832 -

RFQ

400-028-050

データシート

Box 400 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
400-032-050

400-032-050

CONN IC DIP SOCKET 32POS GOLD

3M
2,311 -

RFQ

400-032-050

データシート

Box 400 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100 (2.54mm) Gold 8.00µin (0.203µm) - -
Total 338 Record«Prev1... 7891011121314...17Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
日文版

ホーム

日文版

製品

日文版

電話

日文版

ユーザー