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写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
410-87-228-10-002101

410-87-228-10-002101

CONN ZIG-ZAG 28POS GOLD

Preci-Dip
3,515 -

RFQ

410-87-228-10-002101

データシート

Bulk 410 Active Zig-Zag, Right Stackable 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-328-41-134191

114-87-328-41-134191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,766 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-628-41-001101

115-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,287 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-318-41-001101

614-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,134 -

RFQ

614-83-318-41-001101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-41-105191

110-83-314-41-105191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,812 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-012101

116-83-314-41-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,657 -

RFQ

116-83-314-41-012101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-004101

116-87-310-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,847 -

RFQ

116-87-310-41-004101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-432-41-001101

115-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,267 -

RFQ

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-624-41-001101

110-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,791 -

RFQ

110-83-624-41-001101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-624-41-001151

110-83-624-41-001151

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,155 -

RFQ

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-105191

110-87-320-41-105191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,403 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-316-41-134191

114-83-316-41-134191

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,549 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-008101

116-83-312-41-008101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,536 -

RFQ

116-83-312-41-008101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-012101

116-87-318-41-012101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,034 -

RFQ

116-87-318-41-012101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-424-41-105101

110-87-424-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,166 -

RFQ

110-87-424-41-105101

データシート

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-624-41-105101

110-87-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,254 -

RFQ

110-87-624-41-105101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-624-41-001101

614-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,772 -

RFQ

614-87-624-41-001101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-422-41-001101

115-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,098 -

RFQ

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-322-41-001101

115-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,173 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-011101

116-87-312-41-011101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,573 -

RFQ

116-87-312-41-011101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 2930313233343536...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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