IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-83-316-31-012101

614-83-316-31-012101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,347 -

RFQ

614-83-316-31-012101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-002101

116-87-316-41-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,015 -

RFQ

116-87-316-41-002101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-013101

116-83-306-41-013101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,033 -

RFQ

116-83-306-41-013101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-018101

116-83-316-41-018101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,121 -

RFQ

116-83-316-41-018101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-003101

116-87-420-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,504 -

RFQ

116-87-420-41-003101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-018101

116-87-322-41-018101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,159 -

RFQ

116-87-322-41-018101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-01-762101

110-83-328-01-762101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,284 -

RFQ

110-83-328-01-762101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14), 16 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-310-41-002101

124-83-310-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,940 -

RFQ

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-006101

116-87-420-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,849 -

RFQ

116-87-420-41-006101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-308-11-001101

299-87-308-11-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,423 -

RFQ

299-87-308-11-001101

データシート

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-316-41-035101

146-87-316-41-035101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,583 -

RFQ

146-87-316-41-035101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-316-41-036101

146-87-316-41-036101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,202 -

RFQ

146-87-316-41-036101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-007101

116-83-210-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,263 -

RFQ

116-83-210-41-007101

データシート

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-314-41-001101

121-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,706 -

RFQ

121-83-314-41-001101

データシート

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-320-41-134191

114-83-320-41-134191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,744 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-314-41-001101

122-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,603 -

RFQ

122-83-314-41-001101

データシート

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-314-41-001101

123-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,782 -

RFQ

123-83-314-41-001101

データシート

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-318-41-105101

110-83-318-41-105101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,099 -

RFQ

110-83-318-41-105101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-324-41-001101

612-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,151 -

RFQ

612-87-324-41-001101

データシート

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-624-41-001101

612-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,458 -

RFQ

612-87-624-41-001101

データシート

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 3031323334353637...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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