IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-322-41-001101

116-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,734 -

RFQ

116-87-322-41-001101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-001101

116-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,506 -

RFQ

116-87-422-41-001101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-314-11-001101

299-87-314-11-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,687 -

RFQ

299-87-314-11-001101

データシート

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-008101

116-83-420-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,025 -

RFQ

116-83-420-41-008101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-422-41-001101

121-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,065 -

RFQ

121-83-422-41-001101

データシート

Bulk 121 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-328-41-035101

146-87-328-41-035101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,250 -

RFQ

146-87-328-41-035101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-328-41-036101

146-87-328-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,056 -

RFQ

146-87-328-41-036101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-624-41-001101

122-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,529 -

RFQ

122-87-624-41-001101

データシート

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-624-41-001101

123-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,476 -

RFQ

123-87-624-41-001101

データシート

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-011101

116-87-320-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,792 -

RFQ

116-87-320-41-011101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-002101

116-83-322-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,535 -

RFQ

116-83-322-41-002101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-950-41-001101

110-87-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,296 -

RFQ

110-87-950-41-001101

データシート

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-013101

116-83-610-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,877 -

RFQ

116-83-610-41-013101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-007101

116-87-328-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,495 -

RFQ

116-87-328-41-007101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-006101

116-83-628-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,845 -

RFQ

116-83-628-41-006101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-044-12-071101

510-83-044-12-071101

CONN SOCKET PGA 44POS GOLD

Preci-Dip
3,742 -

RFQ

510-83-044-12-071101

データシート

Bulk 510 Active PGA 44 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-312-11-001101

299-83-312-11-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,172 -

RFQ

299-83-312-11-001101

データシート

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-652-41-001101

110-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,637 -

RFQ

110-87-652-41-001101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-642-41-105101

110-87-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,667 -

RFQ

110-87-642-41-105101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-636-41-117101

114-83-636-41-117101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,454 -

RFQ

114-83-636-41-117101

データシート

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 5455565758596061...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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