IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-87-432-41-105101

117-87-432-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,871 -

RFQ

117-87-432-41-105101

データシート

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-328-41-001101

612-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,004 -

RFQ

612-83-328-41-001101

データシート

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-004101

116-83-314-41-004101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,406 -

RFQ

116-83-314-41-004101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-004101

116-87-316-41-004101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,020 -

RFQ

116-87-316-41-004101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-628-41-001101

612-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,880 -

RFQ

612-83-628-41-001101

データシート

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-009101

116-87-324-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,341 -

RFQ

116-87-324-41-009101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-624-41-105101

117-83-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,032 -

RFQ

117-83-624-41-105101

データシート

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-318-41-801101

110-83-318-41-801101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,084 -

RFQ

110-83-318-41-801101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-642-41-001101

115-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,328 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-011101

116-83-316-41-011101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,100 -

RFQ

116-83-316-41-011101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-008101

116-83-320-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,698 -

RFQ

116-83-320-41-008101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-648-41-001101

110-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,861 -

RFQ

110-87-648-41-001101

データシート

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-648-41-001151

110-87-648-41-001151

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,732 -

RFQ

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-013101

116-87-610-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,075 -

RFQ

116-87-610-41-013101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-013101

116-83-310-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,181 -

RFQ

116-83-310-41-013101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-081-09-000101

510-87-081-09-000101

CONN SOCKET PGA 81POS GOLD

Preci-Dip
3,679 -

RFQ

510-87-081-09-000101

データシート

Bulk 510 Active PGA 81 (9 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-006101

116-83-328-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,211 -

RFQ

116-83-328-41-006101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-648-41-001101

115-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,496 -

RFQ

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-012101

116-83-324-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,747 -

RFQ

116-83-324-41-012101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-41-105161

110-83-328-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,193 -

RFQ

110-83-328-41-105161

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 5253545556575859...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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