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写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-068-11-061101

510-87-068-11-061101

CONN SOCKET PGA 68POS GOLD

Preci-Dip
3,361 -

RFQ

510-87-068-11-061101

データシート

Bulk 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-11-062101

510-87-068-11-062101

CONN SOCKET PGA 68POS GOLD

Preci-Dip
2,632 -

RFQ

510-87-068-11-062101

データシート

Bulk 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-10-001101

510-87-068-10-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip
3,076 -

RFQ

510-87-068-10-001101

データシート

Bulk 510 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-10-061101

510-87-068-10-061101

CONN SOCKET PGA 68POS GOLD

Preci-Dip
3,484 -

RFQ

510-87-068-10-061101

データシート

Bulk 510 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-324-31-012101

614-83-324-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,190 -

RFQ

614-83-324-31-012101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-001101

116-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,502 -

RFQ

116-87-320-41-001101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-001101

116-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,936 -

RFQ

116-87-420-41-001101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-002101

116-87-324-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,177 -

RFQ

116-87-324-41-002101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-432-41-117101

114-83-432-41-117101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,076 -

RFQ

114-83-432-41-117101

データシート

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-018101

116-83-624-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,850 -

RFQ

116-83-624-41-018101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-424-31-012101

614-83-424-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,019 -

RFQ

614-83-424-31-012101

データシート

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-432-41-105101

110-87-432-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,548 -

RFQ

110-87-432-41-105101

データシート

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-650-41-005101

110-87-650-41-005101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,683 -

RFQ

110-87-650-41-005101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-001101

116-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,770 -

RFQ

116-83-316-41-001101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-420-41-001101

121-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,799 -

RFQ

121-83-420-41-001101

データシート

Bulk 121 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-428-41-001101

612-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,688 -

RFQ

612-87-428-41-001101

データシート

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-013101

116-87-310-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,040 -

RFQ

116-87-310-41-013101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-008101

116-87-422-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,137 -

RFQ

116-87-422-41-008101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-004101

116-83-610-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,565 -

RFQ

116-83-610-41-004101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-004101

116-83-210-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,610 -

RFQ

116-83-210-41-004101

データシート

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 4849505152535455...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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