IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-87-448-41-005101

117-87-448-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,721 -

RFQ

117-87-448-41-005101

データシート

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-642-41-001101

110-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,919 -

RFQ

110-87-642-41-001101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-066-11-002101

510-87-066-11-002101

CONN SOCKET PGA 66POS GOLD

Preci-Dip
3,429 -

RFQ

510-87-066-11-002101

データシート

Bulk 510 Active PGA 66 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-002101

116-83-318-41-002101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,391 -

RFQ

116-83-318-41-002101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-011101

116-83-210-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,667 -

RFQ

116-83-210-41-011101

データシート

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-324-41-134191

114-83-324-41-134191

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,808 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-324-41-001101

122-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,555 -

RFQ

122-87-324-41-001101

データシート

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-424-41-001101

122-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,352 -

RFQ

122-87-424-41-001101

データシート

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-324-41-001101

123-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,095 -

RFQ

123-87-324-41-001101

データシート

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-424-41-001101

123-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,419 -

RFQ

123-87-424-41-001101

データシート

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-320-41-001101

121-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,808 -

RFQ

121-83-320-41-001101

データシート

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-012101

116-83-420-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,784 -

RFQ

116-83-420-41-012101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-320-41-001101

122-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,182 -

RFQ

122-83-320-41-001101

データシート

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-420-41-001101

122-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,506 -

RFQ

122-83-420-41-001101

データシート

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-320-41-001101

123-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,983 -

RFQ

123-83-320-41-001101

データシート

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-420-41-001101

123-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,397 -

RFQ

123-83-420-41-001101

データシート

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-628-41-105101

117-87-628-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,035 -

RFQ

117-87-628-41-105101

データシート

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-002101

116-87-422-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,985 -

RFQ

116-87-422-41-002101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-018101

116-83-422-41-018101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,821 -

RFQ

116-83-422-41-018101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-105161

110-87-632-41-105161

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,149 -

RFQ

110-87-632-41-105161

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 4647484950515253...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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