IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-628-41-018101

116-87-628-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,430 -

RFQ

116-87-628-41-018101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-424-41-105101

110-83-424-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,034 -

RFQ

110-83-424-41-105101

データシート

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-006101

116-83-624-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,879 -

RFQ

116-83-624-41-006101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-83-228-10-001101

410-83-228-10-001101

CONN ZIG-ZAG 28POS GOLD

Preci-Dip
3,293 -

RFQ

410-83-228-10-001101

データシート

Bulk 410 Active Zig-Zag, Left Stackable 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-83-228-10-002101

410-83-228-10-002101

CONN ZIG-ZAG 28POS GOLD

Preci-Dip
3,830 -

RFQ

410-83-228-10-002101

データシート

Bulk 410 Active Zig-Zag, Right Stackable 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-624-41-105101

110-83-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,494 -

RFQ

110-83-624-41-105101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-632-41-001101

614-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,888 -

RFQ

614-87-632-41-001101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-322-31-012101

614-83-322-31-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,750 -

RFQ

614-83-322-31-012101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-422-31-012101

614-83-422-31-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,375 -

RFQ

614-83-422-31-012101

データシート

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-037-10-061101

510-83-037-10-061101

CONN SOCKET PGA 37POS GOLD

Preci-Dip
2,628 -

RFQ

510-83-037-10-061101

データシート

Bulk 510 Active PGA 37 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-002101

116-87-322-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,011 -

RFQ

116-87-322-41-002101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-640-41-117101

114-87-640-41-117101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,175 -

RFQ

114-87-640-41-117101

データシート

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-640-41-134161

114-87-640-41-134161

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,839 -

RFQ

114-87-640-41-134161

データシート

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-008101

116-87-420-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,673 -

RFQ

116-87-420-41-008101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-006101

116-83-324-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,846 -

RFQ

116-83-324-41-006101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-009101

116-83-316-41-009101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,211 -

RFQ

116-83-316-41-009101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-624-41-001101

612-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,503 -

RFQ

612-83-624-41-001101

データシート

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-003101

116-83-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,831 -

RFQ

116-83-322-41-003101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-322-41-035101

146-87-322-41-035101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,645 -

RFQ

146-87-322-41-035101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-322-41-036101

146-87-322-41-036101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,733 -

RFQ

146-87-322-41-036101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 4344454647484950...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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