IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-422-41-012101

116-87-422-41-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,681 -

RFQ

116-87-422-41-012101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-324-41-001101

614-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,546 -

RFQ

614-83-324-41-001101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-424-41-001101

614-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,685 -

RFQ

614-83-424-41-001101

データシート

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-007101

116-87-322-41-007101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,528 -

RFQ

116-87-322-41-007101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-328-41-134191

114-83-328-41-134191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,026 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-328-41-003101

115-83-328-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,738 -

RFQ

115-83-328-41-003101

データシート

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-318-41-001101

121-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,609 -

RFQ

121-83-318-41-001101

データシート

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-428-41-117101

114-83-428-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,834 -

RFQ

114-83-428-41-117101

データシート

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-430-41-005101

117-83-430-41-005101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip
2,344 -

RFQ

117-83-430-41-005101

データシート

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-318-41-001101

122-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,215 -

RFQ

122-83-318-41-001101

データシート

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-318-41-001101

123-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,044 -

RFQ

123-83-318-41-001101

データシート

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-064-08-000101

510-87-064-08-000101

CONN SOCKET PGA 64POS GOLD

Preci-Dip
3,573 -

RFQ

510-87-064-08-000101

データシート

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-324-41-105101

110-83-324-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,736 -

RFQ

110-83-324-41-105101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-008101

116-83-316-41-008101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,959 -

RFQ

116-83-316-41-008101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-012101

116-87-324-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,052 -

RFQ

116-87-324-41-012101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-011101

116-87-316-41-011101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,316 -

RFQ

116-87-316-41-011101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-018101

116-83-322-41-018101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,483 -

RFQ

116-83-322-41-018101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-013101

116-83-308-41-013101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,465 -

RFQ

116-83-308-41-013101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-424-41-001101

612-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,877 -

RFQ

612-87-424-41-001101

データシート

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-428-31-012101

614-87-428-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,988 -

RFQ

614-87-428-31-012101

データシート

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 4142434445464748...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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