IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-87-422-41-035101

146-87-422-41-035101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,731 -

RFQ

146-87-422-41-035101

データシート

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-422-41-036101

146-87-422-41-036101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,455 -

RFQ

146-87-422-41-036101

データシート

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-004101

116-83-312-41-004101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,082 -

RFQ

116-83-312-41-004101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-007101

116-83-318-41-007101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,046 -

RFQ

116-83-318-41-007101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-007101

116-87-422-41-007101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,984 -

RFQ

116-87-422-41-007101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-003101

116-83-420-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,780 -

RFQ

116-83-420-41-003101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-09-001101

510-87-068-09-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip
3,948 -

RFQ

510-87-068-09-001101

データシート

Bulk 510 Active PGA 68 (9 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-324-41-105161

110-83-324-41-105161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,636 -

RFQ

110-83-324-41-105161

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-006101

116-83-422-41-006101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,674 -

RFQ

116-83-422-41-006101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-640-41-003101

115-87-640-41-003101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,460 -

RFQ

115-87-640-41-003101

データシート

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-432-41-005101

117-83-432-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,277 -

RFQ

117-83-432-41-005101

データシート

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-628-41-117101

114-83-628-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,007 -

RFQ

114-83-628-41-117101

データシート

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-628-41-134161

114-83-628-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,205 -

RFQ

114-83-628-41-134161

データシート

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-012101

116-83-320-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,003 -

RFQ

116-83-320-41-012101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-064-10-001101

510-87-064-10-001101

CONN SOCKET PGA 64POS GOLD

Preci-Dip
3,400 -

RFQ

510-87-064-10-001101

データシート

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-064-10-051101

510-87-064-10-051101

CONN SOCKET PGA 64POS GOLD

Preci-Dip
2,989 -

RFQ

510-87-064-10-051101

データシート

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-628-41-134191

114-83-628-41-134191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,747 -

RFQ

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-314-41-002101

124-83-314-41-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,766 -

RFQ

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-006101

116-87-428-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,589 -

RFQ

116-87-428-41-006101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-013101

116-87-210-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,221 -

RFQ

116-87-210-41-013101

データシート

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 4445464748495051...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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