IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-432-41-011101

116-87-432-41-011101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,786 -

RFQ

116-87-432-41-011101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-011101

116-87-632-41-011101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,863 -

RFQ

116-87-632-41-011101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-133-13-001101

510-87-133-13-001101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
3,957 -

RFQ

510-87-133-13-001101

データシート

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-133-13-002101

510-87-133-13-002101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
3,197 -

RFQ

510-87-133-13-002101

データシート

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-133-13-041101

510-87-133-13-041101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
2,116 -

RFQ

510-87-133-13-041101

データシート

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-648-41-105101

110-83-648-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,986 -

RFQ

110-83-648-41-105101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-133-13-043101

510-87-133-13-043101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
2,583 -

RFQ

510-87-133-13-043101

データシート

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-003101

116-83-642-41-003101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,955 -

RFQ

116-83-642-41-003101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-642-41-035101

146-87-642-41-035101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,279 -

RFQ

146-87-642-41-035101

データシート

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-642-41-036101

146-87-642-41-036101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,309 -

RFQ

146-87-642-41-036101

データシート

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-652-41-001101

614-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,707 -

RFQ

614-83-652-41-001101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-656-41-105101

117-87-656-41-105101

CONN IC DIP SOCKET 56POS GOLD

Preci-Dip
2,606 -

RFQ

117-87-656-41-105101

データシート

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-132-14-071101

510-87-132-14-071101

CONN SOCKET PGA 132POS GOLD

Preci-Dip
2,709 -

RFQ

510-87-132-14-071101

データシート

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-006101

116-83-650-41-006101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,133 -

RFQ

116-83-650-41-006101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-011101

116-83-428-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,471 -

RFQ

116-83-428-41-011101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-011101

116-83-628-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,959 -

RFQ

116-83-628-41-011101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-011101

116-83-328-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,382 -

RFQ

116-83-328-41-011101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-145-15-081101

510-87-145-15-081101

CONN SOCKET PGA 145POS GOLD

Preci-Dip
3,008 -

RFQ

510-87-145-15-081101

データシート

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-145-17-001101

510-87-145-17-001101

CONN SOCKET PGA 145POS GOLD

Preci-Dip
2,947 -

RFQ

510-87-145-17-001101

データシート

Bulk 510 Active PGA 145 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-011101

116-87-636-41-011101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,711 -

RFQ

116-87-636-41-011101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 8182838485868788...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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