IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-328-41-004101

116-83-328-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,678 -

RFQ

116-83-328-41-004101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-004101

116-83-428-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,268 -

RFQ

116-83-428-41-004101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-964-31-012101

614-87-964-31-012101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,307 -

RFQ

614-87-964-31-012101

データシート

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-11-001101

510-83-100-11-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
2,732 -

RFQ

510-83-100-11-001101

データシート

Bulk 510 Active PGA 100 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-155-16-003101

510-87-155-16-003101

CONN SOCKET PGA 155POS GOLD

Preci-Dip
2,902 -

RFQ

510-87-155-16-003101

データシート

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-155-16-093101

510-87-155-16-093101

CONN SOCKET PGA 155POS GOLD

Preci-Dip
2,669 -

RFQ

510-87-155-16-093101

データシート

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-632-41-105191

110-83-632-41-105191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,637 -

RFQ

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-640-41-801101

110-83-640-41-801101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,412 -

RFQ

110-83-640-41-801101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-018101

116-83-648-41-018101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,087 -

RFQ

116-83-648-41-018101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-428-41-002101

124-83-428-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,199 -

RFQ

Bulk 124 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-628-41-002101

124-83-628-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,736 -

RFQ

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-328-41-002101

124-83-328-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,081 -

RFQ

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-650-41-001101

614-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,199 -

RFQ

614-83-650-41-001101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-013101

116-87-320-41-013101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,752 -

RFQ

116-87-320-41-013101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-013101

116-87-420-41-013101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,163 -

RFQ

116-87-420-41-013101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-001101

116-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,559 -

RFQ

116-83-432-41-001101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-640-41-001101

121-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,308 -

RFQ

121-83-640-41-001101

データシート

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-012101

116-87-650-41-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,860 -

RFQ

116-87-650-41-012101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-009101

116-83-632-41-009101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,354 -

RFQ

116-83-632-41-009101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-002101

116-87-640-41-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,110 -

RFQ

116-87-640-41-002101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 8384858687888990...142Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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