IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1825575-2

1825575-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors
2,380 -

RFQ

1825575-2

データシート

Tape & Reel (TR),Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 196.9µin (5.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester
917-43-210-41-001000

917-43-210-41-001000

CONN SOCKET TRANSIST TO100 10POS

Mill-Max Manufacturing Corp.
3,927 -

RFQ

917-43-210-41-001000

データシート

Tube 917 Active Transistor, TO-100 10 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
12-0513-10

12-0513-10

CONN SOCKET SIP 12POS GOLD

Aries Electronics
2,493 -

RFQ

12-0513-10

データシート

Bulk 0513 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0518-10

17-0518-10

CONN SOCKET SIP 17POS GOLD

Aries Electronics
2,685 -

RFQ

17-0518-10

データシート

Bulk 518 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-83-608-10-002101

299-83-608-10-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,946 -

RFQ

299-83-608-10-002101

データシート

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-003101

116-83-324-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,675 -

RFQ

116-83-324-41-003101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-003101

116-83-624-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,537 -

RFQ

116-83-624-41-003101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-624-41-035101

146-87-624-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,660 -

RFQ

146-87-624-41-035101

データシート

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-624-41-036101

146-87-624-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,690 -

RFQ

146-87-624-41-036101

データシート

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-206-31-018000

714-43-206-31-018000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
2,468 -

RFQ

714-43-206-31-018000

データシート

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-83-428-41-001101

614-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,272 -

RFQ

614-83-428-41-001101

データシート

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
13-0513-10

13-0513-10

CONN SOCKET SIP 13POS GOLD

Aries Electronics
3,956 -

RFQ

13-0513-10

データシート

Bulk 0513 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0513-11

08-0513-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics
2,965 -

RFQ

08-0513-11

データシート

Bulk 0513 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-87-636-41-001101

612-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,955 -

RFQ

612-87-636-41-001101

データシート

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-41-105101

110-83-328-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,879 -

RFQ

110-83-328-41-105101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-628-41-105101

110-83-628-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,531 -

RFQ

110-83-628-41-105101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-320-41-035101

146-83-320-41-035101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,018 -

RFQ

146-83-320-41-035101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-320-41-036101

146-83-320-41-036101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,497 -

RFQ

146-83-320-41-036101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-420-41-035101

146-83-420-41-035101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,430 -

RFQ

146-83-420-41-035101

データシート

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-420-41-036101

146-83-420-41-036101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,658 -

RFQ

146-83-420-41-036101

データシート

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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