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写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-084-10-031101

510-87-084-10-031101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
2,003 -

RFQ

510-87-084-10-031101

データシート

Bulk 510 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-952-41-001101

110-87-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,775 -

RFQ

110-87-952-41-001101

データシート

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-009101

116-83-420-41-009101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,867 -

RFQ

116-83-420-41-009101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-011101

116-83-318-41-011101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,012 -

RFQ

116-83-318-41-011101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-4518-10T

20-4518-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,457 -

RFQ

20-4518-10T

データシート

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-624-41-007101

116-87-624-41-007101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,248 -

RFQ

116-87-624-41-007101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-328-41-001101

122-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,868 -

RFQ

122-87-328-41-001101

データシート

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-428-41-001101

122-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,597 -

RFQ

122-87-428-41-001101

データシート

Bulk 122 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-328-41-001101

123-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,382 -

RFQ

123-87-328-41-001101

データシート

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-428-41-001101

123-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,118 -

RFQ

123-87-428-41-001101

データシート

Bulk 123 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9951442

D01-9951442

CONN SOCKET SIP 14POS GOLD

Harwin Inc.
2,445 -

RFQ

D01-9951442

データシート

Tube D01-995 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
116-83-420-41-001101

116-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,870 -

RFQ

116-83-420-41-001101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-012101

116-87-632-41-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,014 -

RFQ

116-87-632-41-012101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-6513-10T

12-6513-10T

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
2,461 -

RFQ

12-6513-10T

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0513-11H

08-0513-11H

CONN SOCKET SIP 8POS GOLD

Aries Electronics
2,263 -

RFQ

08-0513-11H

データシート

Bulk 0513 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-424-41-009101

116-87-424-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,933 -

RFQ

116-87-424-41-009101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-009101

116-87-624-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,877 -

RFQ

116-87-624-41-009101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-316-T-J

APA-316-T-J

ADAPTER PLUG

Samtec Inc.
2,586 -

RFQ

Tube APA Active - 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
146-83-324-41-035101

146-83-324-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,300 -

RFQ

146-83-324-41-035101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-324-41-036101

146-83-324-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,740 -

RFQ

146-83-324-41-036101

データシート

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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