IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
08-2511-10

08-2511-10

CONN IC DIP SOCKET 8POS TIN

Aries Electronics
3,187 -

RFQ

08-2511-10

データシート

Bulk 511 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-0513-10

16-0513-10

CONN SOCKET SIP 16POS GOLD

Aries Electronics
3,993 -

RFQ

16-0513-10

データシート

Bulk 0513 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0518-10H

19-0518-10H

CONN SOCKET SIP 19POS GOLD

Aries Electronics
2,406 -

RFQ

19-0518-10H

データシート

Bulk 518 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-632-41-001101

614-83-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,049 -

RFQ

614-83-632-41-001101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-018101

116-87-636-41-018101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,026 -

RFQ

116-87-636-41-018101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-424-41-001101

121-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,985 -

RFQ

121-83-424-41-001101

データシート

Bulk 121 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-624-41-001101

121-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,848 -

RFQ

121-83-624-41-001101

データシート

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-308-T-N

APA-308-T-N

ADAPTER PLUG

Samtec Inc.
2,284 -

RFQ

Tube APA Active - 8 (2 x 4) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
346-93-112-41-013000

346-93-112-41-013000

CONN SOCKET SIP 12POS GOLD

Mill-Max Manufacturing Corp.
3,878 -

RFQ

346-93-112-41-013000

データシート

Bulk 346 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-112-41-013000

346-43-112-41-013000

CONN SOCKET SIP 12POS GOLD

Mill-Max Manufacturing Corp.
2,535 -

RFQ

346-43-112-41-013000

データシート

Bulk 346 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-113-41-013000

346-93-113-41-013000

CONN SOCKET SIP 13POS GOLD

Mill-Max Manufacturing Corp.
3,044 -

RFQ

346-93-113-41-013000

データシート

Bulk 346 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-113-41-013000

346-43-113-41-013000

CONN SOCKET SIP 13POS GOLD

Mill-Max Manufacturing Corp.
3,614 -

RFQ

346-43-113-41-013000

データシート

Bulk 346 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-208-31-018000

714-43-208-31-018000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
2,937 -

RFQ

714-43-208-31-018000

データシート

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-056-09-041101

510-83-056-09-041101

CONN SOCKET PGA 56POS GOLD

Preci-Dip
3,844 -

RFQ

510-83-056-09-041101

データシート

Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-011101

116-87-420-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,408 -

RFQ

116-87-420-41-011101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-008101

116-83-422-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,507 -

RFQ

116-83-422-41-008101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-640-41-001101

612-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,313 -

RFQ

612-87-640-41-001101

データシート

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-322-41-011101

116-87-322-41-011101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,044 -

RFQ

116-87-322-41-011101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-002101

116-87-624-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,280 -

RFQ

116-87-624-41-002101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-007101

116-87-428-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,268 -

RFQ

116-87-428-41-007101

データシート

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Record«Prev1... 137138139140141142143144...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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