IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-064-10-051101

510-83-064-10-051101

CONN SOCKET PGA 64POS GOLD

Preci-Dip
3,050 -

RFQ

510-83-064-10-051101

データシート

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-43-116-41-013000

346-43-116-41-013000

CONN SOCKET SIP 16POS GOLD

Mill-Max Manufacturing Corp.
2,252 -

RFQ

346-43-116-41-013000

データシート

Bulk 346 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-096-14-091101

510-87-096-14-091101

CONN SOCKET PGA 96POS GOLD

Preci-Dip
2,111 -

RFQ

510-87-096-14-091101

データシート

Bulk 510 Active PGA 96 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-003101

116-87-642-41-003101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,799 -

RFQ

116-87-642-41-003101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-3513-11

14-3513-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics
2,663 -

RFQ

14-3513-11

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-83-316-11-001101

299-83-316-11-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,916 -

RFQ

299-83-316-11-001101

データシート

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-636-41-001101

614-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,589 -

RFQ

614-83-636-41-001101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-628-41-001101

122-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,201 -

RFQ

122-83-628-41-001101

データシート

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-628-41-001101

123-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,235 -

RFQ

123-83-628-41-001101

データシート

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
19-0513-10

19-0513-10

CONN SOCKET SIP 19POS GOLD

Aries Electronics
2,574 -

RFQ

19-0513-10

データシート

Bulk 0513 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
21-0513-10T

21-0513-10T

CONN SOCKET SIP 21POS GOLD

Aries Electronics
2,163 -

RFQ

21-0513-10T

データシート

Bulk 0513 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-10

27-0518-10

CONN SOCKET SIP 27POS GOLD

Aries Electronics
3,092 -

RFQ

27-0518-10

データシート

Bulk 518 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-87-668-41-005101

117-87-668-41-005101

CONN IC DIP SOCKET 68POS GOLD

Preci-Dip
2,974 -

RFQ

117-87-668-41-005101

データシート

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-097-14-091101

510-87-097-14-091101

CONN SOCKET PGA 97POS GOLD

Preci-Dip
3,591 -

RFQ

510-87-097-14-091101

データシート

Bulk 510 Active PGA 97 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-065-10-051101

510-83-065-10-051101

CONN SOCKET PGA 65POS GOLD

Preci-Dip
3,033 -

RFQ

510-83-065-10-051101

データシート

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-065-10-052101

510-83-065-10-052101

CONN SOCKET PGA 65POS GOLD

Preci-Dip
2,394 -

RFQ

510-83-065-10-052101

データシート

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-002101

116-87-632-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,871 -

RFQ

116-87-632-41-002101

データシート

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-13-063101

510-87-100-13-063101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,172 -

RFQ

510-87-100-13-063101

データシート

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-13-064101

510-87-100-13-064101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,247 -

RFQ

510-87-100-13-064101

データシート

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-105191

110-87-632-41-105191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,721 -

RFQ

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Record«Prev1... 153154155156157158159160...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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