IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
299-43-312-10-001000

299-43-312-10-001000

CONN IC DIP SOCKET 12POS GOLD

Mill-Max Manufacturing Corp.
435 -

RFQ

299-43-312-10-001000

データシート

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-87-764-41-005101

117-87-764-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
934 -

RFQ

117-87-764-41-005101

データシート

Tube 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-13-640-41-001000

110-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
194 -

RFQ

110-13-640-41-001000

データシート

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
D01-9952042

D01-9952042

CONN SOCKET SIP 20POS GOLD

Harwin Inc.
364 -

RFQ

D01-9952042

データシート

Bulk D01-995 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
299-93-314-10-001000

299-93-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
402 -

RFQ

299-93-314-10-001000

データシート

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-320-41-801000

110-13-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
149 -

RFQ

110-13-320-41-801000

データシート

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-320-41-801000

110-93-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
1,028 -

RFQ

110-93-320-41-801000

データシート

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-C182-10

28-C182-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,064 -

RFQ

28-C182-10

データシート

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-43-320-10-001000

299-43-320-10-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
124 -

RFQ

299-43-320-10-001000

データシート

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
10-2810-90C

10-2810-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
719 -

RFQ

10-2810-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-2820-90C

10-2820-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
142 -

RFQ

10-2820-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-2810-90T

10-2810-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics
460 -

RFQ

10-2810-90T

データシート

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
40-C182-10

40-C182-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
252 -

RFQ

40-C182-10

データシート

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-526-10

28-526-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics
1,360 -

RFQ

28-526-10

データシート

Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
12-810-90C

12-810-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics
322 -

RFQ

12-810-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
TDU03DTOD

TDU03DTOD

CONN SOCKET TRANSIST 3POS GOLD

Sullins Connector Solutions
110 -

RFQ

TDU03DTOD

データシート

Tray - Active Transistor 3 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide, Flange Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
714-43-164-31-018000

714-43-164-31-018000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.
259 -

RFQ

714-43-164-31-018000

データシート

Tube 714 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
25-0503-30

25-0503-30

CONN SOCKET SIP 25POS GOLD

Aries Electronics
120 -

RFQ

25-0503-30

データシート

Bulk 0503 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
40-526-10

40-526-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics
3,267 -

RFQ

40-526-10

データシート

Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
32-6554-10

32-6554-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics
706 -

RFQ

32-6554-10

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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