IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-6554-10

40-6554-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics
360 -

RFQ

40-6554-10

データシート

Tube 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6554-11

24-6554-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics
183 -

RFQ

24-6554-11

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6554-10

48-6554-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics
320 -

RFQ

48-6554-10

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6554-11

28-6554-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics
342 -

RFQ

28-6554-11

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6554-11

32-6554-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics
103 -

RFQ

32-6554-11

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
0804MC

0804MC

CONN TRANSIST TO-3 8POS GOLD

Texas Instruments
245 -

RFQ

Tray - Active Transistor, TO-3 8 (Oval) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Polyester, Glass Filled
24-6554-16

24-6554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics
209 -

RFQ

24-6554-16

データシート

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
232-5205-01

232-5205-01

CONN SOCKET QFN 32POS GOLD

3M
2,291 -

RFQ

232-5205-01

データシート

Bulk Textool™ Active QFN 32 (4 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
240-5205-01

240-5205-01

CONN SOCKET QFN 40POS GOLD

3M
3,088 -

RFQ

240-5205-01

データシート

Bulk Textool™ Active QFN 40 (4 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES)
2-2822979-3

2-2822979-3

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors
147 -

RFQ

2-2822979-3

データシート

Tray - Active LGA 3647 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
210-47-308-41-001000

210-47-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
1,576 -

RFQ

210-47-308-41-001000

データシート

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ED020PLCZ

ED020PLCZ

CONN SOCKET PLCC 20POS TIN

On Shore Technology Inc.
2,420 -

RFQ

ED020PLCZ

データシート

Tube ED Active PLCC 20 (4 x 5) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT)
4832-6004-CP

4832-6004-CP

CONN IC DIP SOCKET 32POS TIN

3M
1,424 -

RFQ

4832-6004-CP

データシート

Tube 4800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
AR 06-HZL/07-TT

AR 06-HZL/07-TT

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components
5,609 -

RFQ

AR 06-HZL/07-TT

データシート

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
8432-21A1-RK-TP

8432-21A1-RK-TP

CONN SOCKET PLCC 32POS TIN

3M
1,052 -

RFQ

8432-21A1-RK-TP

データシート

Tube 8400 Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
A-CCS 028-G-T

A-CCS 028-G-T

CONN SOCKET PLCC 28POS GOLD

Assmann WSW Components
875 -

RFQ

A-CCS 028-G-T

データシート

Tube - Active PLCC 28 (4 x 7) 0.050 (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT)
114-87-318-41-134161

114-87-318-41-134161

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
1,047 -

RFQ

114-87-318-41-134161

データシート

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 24-HZL/01/7-TT

AR 24-HZL/01/7-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components
1,434 -

RFQ

AR 24-HZL/01/7-TT

データシート

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
69802-044LF

69802-044LF

CONN SOCKET PLCC 44POS TIN

Amphenol ICC (FCI)
5,333 -

RFQ

69802-044LF

データシート

Tube - Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS)
D2822-42

D2822-42

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.
1,083 -

RFQ

D2822-42

データシート

Tube D2 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
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1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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