IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-3518-10M

06-3518-10M

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
3,957 -

RFQ

06-3518-10M

データシート

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0513-10T

08-0513-10T

CONN SOCKET SIP 8POS GOLD

Aries Electronics
2,819 -

RFQ

08-0513-10T

データシート

Bulk 0513 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0518-11

07-0518-11

CONN SOCKET SIP 7POS GOLD

Aries Electronics
2,481 -

RFQ

07-0518-11

データシート

Bulk 518 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2513-10T

08-2513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,781 -

RFQ

08-2513-10T

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3513-10T

08-3513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,498 -

RFQ

08-3513-10T

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-4513-10T

08-4513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,147 -

RFQ

08-4513-10T

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-11H

04-0518-11H

CONN SOCKET SIP 4POS GOLD

Aries Electronics
3,242 -

RFQ

04-0518-11H

データシート

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-11H

04-1518-11H

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics
3,767 -

RFQ

04-1518-11H

データシート

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-3518-11

06-3518-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
2,562 -

RFQ

06-3518-11

データシート

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0513-11H

04-0513-11H

CONN SOCKET SIP 4POS GOLD

Aries Electronics
2,709 -

RFQ

04-0513-11H

データシート

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0518-10H

09-0518-10H

CONN SOCKET SIP 9POS GOLD

Aries Electronics
3,859 -

RFQ

09-0518-10H

データシート

Bulk 518 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-2513-10

06-2513-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
2,001 -

RFQ

06-2513-10

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-6513-10T

06-6513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
3,386 -

RFQ

06-6513-10T

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0518-10T

10-0518-10T

CONN SOCKET SIP 10POS GOLD

Aries Electronics
2,925 -

RFQ

10-0518-10T

データシート

Bulk 518 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-1518-10T

10-1518-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics
2,470 -

RFQ

10-1518-10T

データシート

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-10

11-0518-10

CONN SOCKET SIP 11POS GOLD

Aries Electronics
3,572 -

RFQ

11-0518-10

データシート

Bulk 518 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0517-90C

03-0517-90C

CONN SOCKET SIP 3POS GOLD

Aries Electronics
2,452 -

RFQ

03-0517-90C

データシート

Bulk 0517 Active SIP 3 (1 x 3) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3513-10

08-3513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,439 -

RFQ

08-3513-10

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0513-10

08-0513-10

CONN SOCKET SIP 8POS GOLD

Aries Electronics
3,817 -

RFQ

08-0513-10

データシート

Bulk 0513 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0513-11

05-0513-11

CONN SOCKET SIP 5POS GOLD

Aries Electronics
2,565 -

RFQ

05-0513-11

データシート

Bulk 0513 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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