IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
01-0508-20

01-0508-20

CONN SOCKET SIP 1POS GOLD

Aries Electronics
2,070 -

RFQ

01-0508-20

データシート

Bulk 508 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
01-0508-30

01-0508-30

CONN SOCKET SIP 1POS GOLD

Aries Electronics
2,632 -

RFQ

01-0508-30

データシート

Bulk 508 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
02-0513-11

02-0513-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics
3,072 -

RFQ

02-0513-11

データシート

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-10H

04-0518-10H

CONN SOCKET SIP 4POS GOLD

Aries Electronics
3,556 -

RFQ

04-0518-10H

データシート

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-10H

04-1518-10H

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics
2,561 -

RFQ

04-1518-10H

データシート

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-10

05-0518-10

CONN SOCKET SIP 5POS GOLD

Aries Electronics
2,140 -

RFQ

05-0518-10

データシート

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0513-10T

04-0513-10T

CONN SOCKET SIP 4POS GOLD

Aries Electronics
3,000 -

RFQ

04-0513-10T

データシート

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0503-20

01-0503-20

CONN SOCKET SIP 1POS GOLD

Aries Electronics
2,355 -

RFQ

01-0503-20

データシート

Bulk 0503 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
01-0503-30

01-0503-30

CONN SOCKET SIP 1POS GOLD

Aries Electronics
2,774 -

RFQ

01-0503-30

データシート

Bulk 0503 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Tin 30.0µin (0.76µm) Brass Polyamide (PA), Nylon, Glass Filled
02-0513-11H

02-0513-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics
2,938 -

RFQ

02-0513-11H

データシート

Bulk 0513 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0513-10

04-0513-10

CONN SOCKET SIP 4POS GOLD

Aries Electronics
3,142 -

RFQ

04-0513-10

データシート

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-00

04-1518-00

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics
2,896 -

RFQ

04-1518-00

データシート

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-11H

02-0518-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics
3,053 -

RFQ

02-0518-11H

データシート

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-11H

02-1518-11H

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics
2,576 -

RFQ

02-1518-11H

データシート

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-00

04-0518-00

CONN SOCKET SIP 4POS GOLD

Aries Electronics
3,359 -

RFQ

04-0518-00

データシート

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-11

04-0518-11

CONN SOCKET SIP 4POS GOLD

Aries Electronics
2,872 -

RFQ

04-0518-11

データシート

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-11

04-1518-11

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics
2,282 -

RFQ

04-1518-11

データシート

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-10T

05-0518-10T

CONN SOCKET SIP 5POS GOLD

Aries Electronics
2,792 -

RFQ

05-0518-10T

データシート

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0518-10H

05-0518-10H

CONN SOCKET SIP 5POS GOLD

Aries Electronics
2,123 -

RFQ

05-0518-10H

データシート

Bulk 518 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-1518-10

06-1518-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics
2,120 -

RFQ

06-1518-10

データシート

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Record«Prev1... 56789101112...217Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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