IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
08-810-90

08-810-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,066 -

RFQ

08-810-90

データシート

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
917-43-208-41-005000

917-43-208-41-005000

CONN SOCKET TRANSIST TO-100 8POS

Mill-Max Manufacturing Corp.
3,427 -

RFQ

917-43-208-41-005000

データシート

Tube 917 Active Transistor, TO-100 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
10-2820-90T

10-2820-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics
100 -

RFQ

10-2820-90T

データシート

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
110-87-628-41-105101

110-87-628-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
460 -

RFQ

110-87-628-41-105101

データシート

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-640-SGT

ICO-640-SGT

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.
2,338 -

RFQ

ICO-640-SGT

データシート

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
117-43-764-41-005000

117-43-764-41-005000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.
2,794 -

RFQ

117-43-764-41-005000

データシート

Tube 117 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-87-642-41-005101

117-87-642-41-005101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,046 -

RFQ

117-87-642-41-005101

データシート

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-105101

110-87-632-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
216 -

RFQ

110-87-632-41-105101

データシート

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-008101

116-87-320-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
989 -

RFQ

116-87-320-41-008101

データシート

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-823-90

16-823-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
100 -

RFQ

16-823-90

データシート

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
614-87-628-31-012101

614-87-628-31-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,220 -

RFQ

614-87-628-31-012101

データシート

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-810-90C

16-810-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
3,399 -

RFQ

16-810-90C

データシート

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-13-640-41-801000

110-13-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
3,120 -

RFQ

110-13-640-41-801000

データシート

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-264-31-018000

714-43-264-31-018000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.
2,048 -

RFQ

714-43-264-31-018000

データシート

Tube 714 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
209-PGM17020-10

209-PGM17020-10

CONN SOCKET PGA GOLD

Aries Electronics
3,191 -

RFQ

209-PGM17020-10

データシート

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6823-90

40-6823-90

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,287 -

RFQ

40-6823-90

データシート

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
232-1285-00-0602J

232-1285-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

3M
3,119 -

RFQ

232-1285-00-0602J

データシート

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
228-1290-00-0602J

228-1290-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M
3,996 -

RFQ

228-1290-00-0602J

データシート

Bulk Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
242-1281-00-0602J

242-1281-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M
2,469 -

RFQ

242-1281-00-0602J

データシート

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
228-4817-00-0602J

228-4817-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M
2,207 -

RFQ

228-4817-00-0602J

データシート

Bulk Textool™ Active DIP, ZIF (ZIP), 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
Total 21991 Record«Prev1... 3940414243444546...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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