IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-6574-10

40-6574-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics
3,101 -

RFQ

40-6574-10

データシート

Tube 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-9513-10

40-9513-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,542 -

RFQ

40-9513-10

データシート

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1-2324271-8

1-2324271-8

LEFT SEGMEN LGA4189-5 SOCKET-P5

TE Connectivity AMP Connectors
2,459 -

RFQ

1-2324271-8

データシート

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1-2324271-7

1-2324271-7

RIGHT SEGMEN LGA4189-5 SOCKET-P5

TE Connectivity AMP Connectors
3,944 -

RFQ

1-2324271-7

データシート

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
2-2129710-8

2-2129710-8

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors
2,490 -

RFQ

2-2129710-8

データシート

Tray - Active LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic
2-2822979-4

2-2822979-4

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors
2,410 -

RFQ

2-2822979-4

データシート

Tray - Active LGA 3647 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
260-4204-01

260-4204-01

CONN SOCKET QFN 60POS GOLD

3M
3,863 -

RFQ

260-4204-01

データシート

Bulk Textool™ Active QFN 60 (4 x 15) 0.016 (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016 (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES)
NTE435P18

NTE435P18

SOCKET FOR 18 PIN DIP

NTE Electronics, Inc
722 -

RFQ

NTE435P18

データシート

Bag - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) - - - Through Hole Open Frame Solder 0.100 (2.54mm) - - - -
NTE423

NTE423

SOCKET-MINI-DIP 8-PIN

NTE Electronics, Inc
836 -

RFQ

NTE423

データシート

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) - - - - Through Hole - Solder - - - - -
NTE435P20

NTE435P20

IC 20 PIN DUAL INLINE

NTE Electronics, Inc
245 -

RFQ

NTE435P20

データシート

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) - - - - Through Hole - Solder 0.100 (2.54mm) - - - -
NTE429

NTE429

28-PIN SOCKET

NTE Electronics, Inc
398 -

RFQ

NTE429

データシート

Bulk - Active - 28 (2 x 14) - - - - Through Hole Open Frame Solder - - - - -
NTE409

NTE409

IC SOCKET 14 PIN DIP

NTE Electronics, Inc
202 -

RFQ

NTE409

データシート

Bulk - Active - 14 (2 x 7) - - - - Through Hole - Solder - - - - -
NTE428

NTE428

24-PIN SOCKET

NTE Electronics, Inc
562 -

RFQ

NTE428

データシート

Bulk - Active - 24 (2 x 12) - - - - Through Hole - Solder - - - - -
NTE435P6

NTE435P6

IC DUAL INLINE 6 PIN

NTE Electronics, Inc
3,296 -

RFQ

NTE435P6

データシート

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) - - - - - - Solder 0.100 (2.54mm) - - - -
NTE430

NTE430

SOCKET 40 PIN

NTE Electronics, Inc
643 -

RFQ

NTE430

データシート

Bulk - Active - 40 (2 x 20) - - - - Through Hole - Solder - - - - -
NTE435K30

NTE435K30

SOCKET-30 PIN DIP .070

NTE Electronics, Inc
192 -

RFQ

NTE435K30

データシート

Bulk - Active DIP, 0.4 (10.16mm) Row Spacing - - - - - Through Hole - Solder 0.070 (1.78mm) - - - -
NTE416

NTE416

SOCKET 16PIN DIP

NTE Electronics, Inc
440 -

RFQ

NTE416

データシート

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) - - - - - Solder 0.100 (2.54mm) - - - -
NTE435K28

NTE435K28

SOCKET-28 PIN DIP .070

NTE Electronics, Inc
989 -

RFQ

NTE435K28

データシート

Bulk - Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) - - - - Through Hole - Solder 0.070 (1.78mm) - - - -
NTE435P42

NTE435P42

SOCKET-42 PIN DIP

NTE Electronics, Inc
3,418 -

RFQ

NTE435P42

データシート

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) - - - - Through Hole - Solder 0.100 (2.54mm) - - - -
NTE421

NTE421

SOCKET-TO-66 PWR

NTE Electronics, Inc
3,824 -

RFQ

NTE421

データシート

Bulk - Active Transistor, TO-66 - - - - - Through Hole - Solder - - - - -
Total 21991 Record«Prev1... 4243444546474849...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
日文版

ホーム

日文版

製品

日文版

電話

日文版

ユーザー