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| 写真: | メーカー部品番号 | 在庫状況 | 価格 | 数量 | データシート | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
299-93-318-11-001000CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp. |
3,244 | - |
RFQ |
データシート |
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
299-93-614-10-002000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
2,054 | - |
RFQ |
データシート |
Tube | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
299-93-616-10-002000CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp. |
3,175 | - |
RFQ |
データシート |
Tube | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
123-43-628-41-801000CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp. |
3,921 | - |
RFQ |
データシート |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
299-43-324-10-001000CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp. |
3,082 | - |
RFQ |
データシート |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
299-93-324-10-001000CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp. |
3,393 | - |
RFQ |
データシート |
Tube | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2201838-2CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors |
2,640 | - |
RFQ |
データシート |
Bulk | - | Last Time Buy | LGA | 2011 (47 x 58) | 0.040 (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035 (0.90mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
123-93-640-41-801000CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp. |
3,046 | - |
RFQ |
データシート |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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|
123-43-964-41-001000CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp. |
2,713 | - |
RFQ |
データシート |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
200-6311-9UN-1900CONN SOCKET PGA ZIF 121POS GOLD 3M |
2,863 | - |
RFQ |
データシート |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 121 (11 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) |
|
210-83-308-41-101000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
2,023 | - |
RFQ |
Tube | 210 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 300.0µin (7.62µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
110-83-308-41-530000CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp. |
3,482 | - |
RFQ |
データシート |
Tube | 110 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-83-314-41-530000CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp. |
3,950 | - |
RFQ |
Tube | 110 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
110-83-316-41-530000CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp. |
3,300 | - |
RFQ |
Tube | 110 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
110-83-318-41-530000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,178 | - |
RFQ |
データシート |
Tube | 110 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-83-628-41-530000CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp. |
2,861 | - |
RFQ |
Tube | 110 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
200-6317-9UN-1900CONN SOCKET PGA ZIF 289POS GOLD 3M |
3,844 | - |
RFQ |
データシート |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 289 (17 x 17) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) |
|
|
235-3019-01-0602CONN ZIG-ZAG ZIF 35POS GOLD 3M |
2,262 | - |
RFQ |
データシート |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 35 (1 x 17, 1 x 18) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
|
XR2A-0815CONNECTORS - CONNECTOR Omron Electronics Inc-EMC Div |
107 | - |
RFQ |
データシート |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
110-44-424-41-001000CONN IC DIP SOCKET 24POS TIN Mill-Max Manufacturing Corp. |
5,481 | - |
RFQ |
データシート |
Tube | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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