IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-43-314-41-006000

116-43-314-41-006000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
3,692 -

RFQ

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-6574-10

28-6574-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics
3,110 -

RFQ

28-6574-10

データシート

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
242-1289-00-0602J

242-1289-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M
2,470 -

RFQ

242-1289-00-0602J

データシート

Bulk Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
256-4205-01

256-4205-01

CONN SOCKET QFN 56POS GOLD

3M
2,740 -

RFQ

256-4205-01

データシート

Bulk Textool™ Active QFN 56 (4 x 14) 0.016 (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016 (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES)
NTE435P22

NTE435P22

SOCKET FOR 22 PIN DIP

NTE Electronics, Inc
3,253 -

RFQ

NTE435P22

データシート

Bag - Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) - - - Through Hole Open Frame Solder 0.100 (2.54mm) - - - -
210-1-24-006

210-1-24-006

CONN IC DIP SOCKET 24POS GOLD

CNC Tech
2,289 -

RFQ

210-1-24-006

データシート

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
D01-9970942

D01-9970942

CONN SOCKET SIP 9POS GOLD

Harwin Inc.
667 -

RFQ

D01-9970942

データシート

Tube D01-997 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
210-1-32-006

210-1-32-006

CONN IC DIP SOCKET 32POS GOLD

CNC Tech
3,227 -

RFQ

210-1-32-006

データシート

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
210-1-48-006

210-1-48-006

CONN IC DIP SOCKET 48POS GOLD

CNC Tech
3,268 -

RFQ

210-1-48-006

データシート

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
NTE436W14

NTE436W14

14-PIN DIP IC SOCKET

NTE Electronics, Inc
2,657 -

RFQ

NTE436W14

データシート

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) - - - - Through Hole - Wire Wrap - - - - -
NTE436W16

NTE436W16

16-PIN DIP IC SOCKET

NTE Electronics, Inc
3,483 -

RFQ

NTE436W16

データシート

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) - - - - Through Hole - Wire Wrap - - - - -
8484-21A1-RK-TP

8484-21A1-RK-TP

CONN SOCKET PLCC 84POS TIN

3M
3,441 -

RFQ

8484-21A1-RK-TP

データシート

Tube 8400 Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
211-1-48-006

211-1-48-006

CONN IC DIP SOCKET 48POS GOLD

CNC Tech
2,758 -

RFQ

211-1-48-006

データシート

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT)
ICA-324-STT

ICA-324-STT

CONN IC DIP SOCKET 24POS TIN

Samtec Inc.
3,469 -

RFQ

ICA-324-STT

データシート

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
216-3340-00-0602J

216-3340-00-0602J

CONN IC DIP SOCKET ZIF 16POS GLD

3M
3,068 -

RFQ

216-3340-00-0602J

データシート

Tube Textool™ Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
AW 127-02/Z-T

AW 127-02/Z-T

SOCKET 2 CONTACTS SINGLE ROW

Assmann WSW Components
2,934 -

RFQ

AW 127-02/Z-T

データシート

- - Active - - - - - - - - - - - - - -
AW 127-03/Z-T

AW 127-03/Z-T

SOCKET 3 CONTACTS SINGLE ROW

Assmann WSW Components
3,465 -

RFQ

AW 127-03/Z-T

データシート

- - Active - - - - - - - - - - - - - -
AW 127-05/Z-T

AW 127-05/Z-T

SOCKET 5 CONTACTS SINGLE ROW

Assmann WSW Components
2,525 -

RFQ

AW 127-05/Z-T

データシート

- - Active - - - - - - - - - - - - - -
AW 127-06/Z-T

AW 127-06/Z-T

SOCKET 6 CONTACTS SINGLE ROW

Assmann WSW Components
2,229 -

RFQ

AW 127-06/Z-T

データシート

- - Active - - - - - - - - - - - - - -
AW 127-07/Z-T

AW 127-07/Z-T

SOCKET 7 CONTACTS SINGLE ROW

Assmann WSW Components
3,569 -

RFQ

AW 127-07/Z-T

データシート

- - Active - - - - - - - - - - - - - -
Total 21991 Record«Prev1... 5354555657585960...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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