IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
01-0518-10

01-0518-10

CONN SOCKET SIP 1POS GOLD

Aries Electronics
3,739 -

RFQ

01-0518-10

データシート

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0518-10H

01-0518-10H

CONN SOCKET SIP 1POS GOLD

Aries Electronics
3,059 -

RFQ

01-0518-10H

データシート

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
AR 10-HZL/01-TT

AR 10-HZL/01-TT

CONN IC DIP SOCKET 10POS TIN

Assmann WSW Components
2,078 -

RFQ

AR 10-HZL/01-TT

データシート

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
614-83-304-41-001101

614-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,214 -

RFQ

614-83-304-41-001101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-18/Z-T

AW 127-18/Z-T

SOCKET 18 CONTACTS SINGLE ROW

Assmann WSW Components
3,836 -

RFQ

AW 127-18/Z-T

データシート

- - Active - - - - - - - - - - - - - -
110-83-304-41-105101

110-83-304-41-105101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,536 -

RFQ

110-83-304-41-105101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-101-41-013000

346-93-101-41-013000

CONN SOCKET SIP 1POS GOLD

Mill-Max Manufacturing Corp.
2,174 -

RFQ

346-93-101-41-013000

データシート

Bulk 346 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-83-304-41-001101

612-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,262 -

RFQ

612-83-304-41-001101

データシート

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-006101

116-83-304-41-006101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,787 -

RFQ

116-83-304-41-006101

データシート

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
01-0518-10T

01-0518-10T

CONN SOCKET SIP 1POS GOLD

Aries Electronics
3,150 -

RFQ

01-0518-10T

データシート

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0518-11

01-0518-11

CONN SOCKET SIP 1POS GOLD

Aries Electronics
3,390 -

RFQ

01-0518-11

データシート

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-87-304-41-001101

122-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,498 -

RFQ

122-87-304-41-001101

データシート

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-304-41-001101

123-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,321 -

RFQ

123-87-304-41-001101

データシート

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-19/Z-T

AW 127-19/Z-T

SOCKET 19 CONTACTS SINGLE ROW

Assmann WSW Components
2,112 -

RFQ

AW 127-19/Z-T

データシート

- - Active - - - - - - - - - - - - - -
116-83-304-41-018101

116-83-304-41-018101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,598 -

RFQ

116-83-304-41-018101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-007101

116-87-304-41-007101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,653 -

RFQ

116-87-304-41-007101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-308-41-001101

115-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,471 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-306-41-001101

110-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,394 -

RFQ

110-83-306-41-001101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-304-31-012101

614-83-304-31-012101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,560 -

RFQ

614-83-304-31-012101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-306-41-105101

110-87-306-41-105101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,616 -

RFQ

110-87-306-41-105101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Record«Prev1... 5657585960616263...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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