IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-304-41-001101

116-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,024 -

RFQ

116-83-304-41-001101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 18-HZL/01-TT

AR 18-HZL/01-TT

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components
2,078 -

RFQ

AR 18-HZL/01-TT

データシート

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
614-87-308-31-012101

614-87-308-31-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,318 -

RFQ

614-87-308-31-012101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-308-41-134191

114-87-308-41-134191

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,354 -

RFQ

Tape & Reel (TR),Cut Tape (CT) 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 10-HZL/07-TT

AR 10-HZL/07-TT

IC SOCKET 10 PIN MACH CONT

Assmann WSW Components
3,819 -

RFQ

AR 10-HZL/07-TT

データシート

Tube - Active - - - - - - - - - - - - - -
AW 127-33/Z-T

AW 127-33/Z-T

SOCKET 34 CONTACTS SINGLE ROW

Assmann WSW Components
2,033 -

RFQ

AW 127-33/Z-T

データシート

- - Active - - - - - - - - - - - - - -
110-87-210-01-742101

110-87-210-01-742101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,708 -

RFQ

110-87-210-01-742101

データシート

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-306-31-012101

614-83-306-31-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,438 -

RFQ

614-83-306-31-012101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-308-41-003101

115-83-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,069 -

RFQ

115-83-308-41-003101

データシート

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-002101

116-87-306-41-002101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,031 -

RFQ

116-87-306-41-002101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-003101

116-83-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,945 -

RFQ

116-83-306-41-003101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 24-HZL/7-TT

AR 24-HZL/7-TT

CONN IC DIP SOCKET 24POS TIN

Assmann WSW Components
2,635 -

RFQ

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
116-87-304-41-004101

116-87-304-41-004101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,340 -

RFQ

116-87-304-41-004101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-210-41-001101

110-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,793 -

RFQ

110-83-210-41-001101

データシート

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-312-41-117101

114-87-312-41-117101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,947 -

RFQ

114-87-312-41-117101

データシート

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-312-41-134161

114-87-312-41-134161

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,354 -

RFQ

114-87-312-41-134161

データシート

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-008101

116-87-306-41-008101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,931 -

RFQ

116-87-306-41-008101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-318-41-001151

110-87-318-41-001151

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,594 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-20/Z-T

AW 127-20/Z-T

SOCKET 20 CONTACTS SINGLE ROW

Assmann WSW Components
2,177 -

RFQ

AW 127-20/Z-T

データシート

Bulk - Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS)
110-87-210-41-105101

110-87-210-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,102 -

RFQ

110-87-210-41-105101

データシート

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Record«Prev1... 6465666768697071...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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