IC、トランジスタ用ソケット

写真: メーカー部品番号 在庫状況 価格 数量 データシート Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-87-314-10-001101

110-87-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,977 -

RFQ

110-87-314-10-001101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-003101

116-87-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,582 -

RFQ

116-87-308-41-003101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-304-41-002101

124-83-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,979 -

RFQ

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-103-41-005101

917-83-103-41-005101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip
2,150 -

RFQ

917-83-103-41-005101

データシート

Bulk 917 Active Transistor, TO-5 3 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-103-41-053101

917-83-103-41-053101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip
3,812 -

RFQ

917-83-103-41-053101

データシート

Bulk 917 Active Transistor, TO-5 3 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ED044PLCZ-SM-N

ED044PLCZ-SM-N

CONN SOCKET PLCC 44POS

On Shore Technology Inc.
2,610 -

RFQ

ED044PLCZ-SM-N

データシート

Tube ED Active PLCC 44 (2 x 22) 0.050 (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS)
114-83-306-41-134191

114-83-306-41-134191

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,613 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-35/Z-T

AW 127-35/Z-T

SOCKET 35 CONTACTS SINGLE ROW

Assmann WSW Components
2,234 -

RFQ

AW 127-35/Z-T

データシート

- - Active - - - - - - - - - - - - - -
03-0518-10T

03-0518-10T

CONN SOCKET SIP 3POS GOLD

Aries Electronics
2,333 -

RFQ

03-0518-10T

データシート

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0517-90C

01-0517-90C

CONN SOCKET SIP 1POS GOLD

Aries Electronics
2,962 -

RFQ

01-0517-90C

データシート

Bulk 0517 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-304-41-011101

116-83-304-41-011101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,811 -

RFQ

116-83-304-41-011101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-001101

110-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,171 -

RFQ

110-83-310-41-001101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-610-41-001101

110-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,419 -

RFQ

110-83-610-41-001101

データシート

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-310-41-105101

110-87-310-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,583 -

RFQ

110-87-310-41-105101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-310-41-001101

614-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,656 -

RFQ

614-87-310-41-001101

データシート

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-610-41-001101

614-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,532 -

RFQ

614-87-610-41-001101

データシート

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SBU130Z

SBU130Z

CONN SOCKET SIP 13POS GOLD

On Shore Technology Inc.
3,694 -

RFQ

SBU130Z

データシート

Bulk SBU Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
110-87-312-01-680101

110-87-312-01-680101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,875 -

RFQ

110-87-312-01-680101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6), 6 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-01-822101

110-87-316-01-822101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,291 -

RFQ

110-87-316-01-822101

データシート

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8), 4 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-009101

116-87-306-41-009101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,830 -

RFQ

116-87-306-41-009101

データシート

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Record«Prev1... 6566676869707172...1100Next»
1500+
1500+ 日平均RFQ
20,000.000
20,000.000 標準製品ユニット
1800+
1800+ 世界中のメーカー
15,000+
15,000+ 在庫倉庫
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